Riso Kagaku Corporation

Other

Hitachi, Ltd.

Kao Corporation

Masakazu Kawano

Natsuki Yokoyama

Hideo Watanabe

Shuntaro Machida

Sadanao Okuda

Makoto Ishikawa

Hiroyuki Ikeda

Masashi Hara

Masatoshi Fujimoto

Taiichi Takezaki

Yukihiro Maeda

Yukihiro Fukuyama

Yoshifumi Noguchi

Akinori Maekawa

Takao Kawabe

Masato Murayama

Akio Kobayashi

Akira Ikezawa

A highly-sensitive ultrasonic transducer with good yield is provided. The ultrasonic transducer includes a cavity layer, a pair of electrodes positioned above and below the cavity layer, insulating layers disposed above and below each of the pair of electrodes, and a filled hole that penetrates, in a vertical direction, at least a portion of the insulating layers positioned above the cavity layer. When the ultrasonic transducer is viewed from above, each electrode of the pair of electrodes includes, at a position that overlaps the embedded hole, a non-electrode region where the electrodes are not formed.

Ultrasonic transducer, manufacturing method thereof, and ultrasonic imaging device

An enclosing-sealing device for preparing a sealed matter by sealing an envelope with a content enclosed in the envelope includes a content formation unit, an envelope formation unit, a content delivery unit, a seal unit, a delivery timing determiner, and a delivery controller. The content delivery unit delivers the content delivered from the content formation unit to the envelope formation unit such that the content is enclosed in a sheet of envelope paper while being folded. The seal unit seals the envelope delivered from the envelope formation unit with the content enclosed in the envelope. The delivery timing determiner determines a delivery timing of the content by the content delivery unit based on inputted information about at least one of the content and the envelope. The delivery controller controls the content delivery unit to deliver the content to the envelope formation unit in accordance with the determined delivery timing.

Enclosing-sealing device and image formation system having the same

The present invention relates to an asphalt mixture including aggregates, a polyamide resin and asphalt, wherein the polyamide resin has a softening point of from 60 to 150&#xb0; C., and is compounded in an amount of from 3 to 90% by mass on the basis of a total amount of the polyamide resin and the asphalt; and a paving method using the asphalt mixture. The asphalt mixture of the present invention provides a pavement which is free from rutting and torsional breakage and exhibits a high oil resistance. The pavement obtained from the asphalt mixture is free from fracture and can be prevented from suffering from occurrence of rutting and torsional breakage even when leakage of oils over a surface of the pavement occurs.

Asphalt mixture

A conveyance control mechanism for a printer including an image forming unit forming an image on a sheet being conveyed on a conveyance route, includes a curl detector configured to detect a curl of the sheet conveyed on the conveyance route, in an upstream of the image forming unit on the conveyance route. The conveyance route controller may drive and stop the conveyance route differently depending on whether the curl detector detects a curl at either a front end or at a position other than the front end. When the curl detector detects a curl of the sheet, an image forming route where the image forming unit performs an image formation may be separated and retreated from the conveyance route and the sheet being conveyed may be discharged onto the retreated image forming route.

Transfer control mechanism for printer and transfer control method

A layer comprising a second metal silicide as a major constituent element or a layer comprising a second metal as a major constituent element is formed simultaneously by one single chemical vapor deposition process to the bottom surface of two out of there groups of openings etched in a dielectric film on a substrate. A surface comprising silicon as a major constituent element is exposed at each bottom (&ldquo;through holes or local interconnection holes&rdquo;) of the first group of openings, a surface comprising a first metal silicide as a major constituent element is exposed at each bottom of the second group of openings, and a surface comprising a first metal as a major constituent element is exposed at each bottom of the third group of openings. The manufacturing method provides low contact resistance and sufficiently small junction leakage current from a diffusion layer in connection with plugs or local interconnections, even if the etched area of the openings are of different depths, shapes, or sizes.

Method of manufacturing semiconductor device

A stencil printing apparatus is provided, which comprises a pressure chamber having a first wall and a second wall both of which face each other and are built up together via a frame-like packing, said first wall comprising a frame member which has flexibility in all directions and on which a diaphragm having flexibility is extended; means for supporting a stencil so as to have the stencil disposed opposite to said diaphragm in the pressure chamber; means for supporting printing paper so as to have the printing paper disposed between the stencil and the second wall in the pressure chamber, and means for reducing pressure in the pressure chamber. The diaphragm may be extended on the frame member by laminating it onto the frame member, and the packing and the means for supporting a stencil may be installed on part of said diaphragm overlapping with the frame member. The means for supporting a stencil may be a pair of fabric fastener, one half of the pair being fixed to the frame member.

Stencil printing method and apparatus

A stencil sheet having a solvent-soluble resin layer is made by a plate-making apparatus, which is formed of a holding and moving device to hold and move the stencil sheet, a solvent supply device for supplying a solvent to the stencil sheet, and a control device. The solvent supply device is disposed at a predetermined distance away from the stencil sheet held by the holding and moving device and is moved with respect to the stencil sheet at least one of a horizontal scanning direction and a vertical scanning direction intersecting with each other. The control device obtains image signals of an image to be produced on the stencil sheet and controls the solvent supply device so that an amount of the solvent to be fed to the stencil sheet by the solvent supply device is changed based on the image signals to thereby perforate holes in the stencil sheet. The sizes of the holes perforated by the solvent is changed by the amount thereof to alter gradation of the image.

Plate-making method and apparatus for stencil sheet

A stencil printing machine having a stencil sheet composed of a resin film and a substrate and curled in one direction is formed of a perforating section for perforating the stencil sheet; a printing drum wrapped around with the stencil sheet perforated at the perforating section, and driven to rotate about the axis thereof; a conveying device for conveying the stencil sheet to the printing drum in such a manner that an edge of the stencil sheet perforated at the perforating section is substantially in parallel with one linear line of the printing drum; a clamp device for clamping the edge of the stencil sheet conveyed by the conveying device to the printing drum, on the printing drum along one linear line of the printing drum; and a stencil discharge section for removing the stencil sheet from the printing drum after printing.

Growing community of inventors

Tokyo, Japan

Masakazu Kawano