Dowa Electronics Materials Co., Ltd.

Central Research Institute of Electric Power Industry

Other

Masakazu Kawahara

Masahiro Kojima

Michiharu Ichikawa

Hiroyuki Kado

Masatoyo Shibuya

Michiharu c/o Central Research Institute Ichikawa

Hiroyuki c/o Central Research Institute Kado

Masatoyo c/o Central Research Institute Shibuya

The present invention provides a Bi2223 based thick film that does not peel off when a thermal or a mechanical shock is applied to a base or an oxide superconductor thick film or the like in the middle of a manufacturing process and a method of manufacturing the same. An oxide superconductor pastehaving a mixing ratio of Bi2212 composition is applied to a basedried, burned, and thereafter burned at a temperature approximate to its melting point to obtain a partially molten layer. Next, an oxide superconductor pastehaving a mixing ratio of Bi2223 composition is applied to the partially molten layer, dried, burned, compressed by a CIP, and thereafter repeatedly burned and compressed for a predetermined number of times to obtain the basehaving a desired superconductor thick filmformed thereon.

Oxide superconductor thick film and method for manufacturing the same

To provide an oxide superconductor thick film formation method that can enhance adhesiveness of a Bi2223 thick film to a body to be processed on which the Bi2223 thick film is formed, and increase a cross-sectional area of the Bi2223 thick film, without a decrease in Jc of the Bi2223 thick film. A mixture of a compound oxide having composition Bi2212 and Pb is applied to a surface of the body to be processed, and burned to form a first thick film. An oxide superconductor thick film expressed by a general formula (Bi, Pb)SrCaCuO(where &#x2212;0.1&#x2266;a&#x2266;0.5) is formed on the first thick film.

Method of forming oxide superconductor thick film

The present invention provides an oxide superconductor thick film which is formed on a substrate or a board and has a high Jc and Ic and a method for manufacturing the same. Predetermined amounts of materials containing elements of Bi, Pb, Sr, Ca and Cu are weighed, mixed and subjected to steps of calcining, milling, and drying, and thereafter an organic binder and an organic vehicle are added thereto to prepare a (Bi, Pb)SrCaCuOsuperconductive paste, which is applied to the surface of a substrate or a board in a thickness of 260 &#x3bc;m or more and dried. Thereafter, the paste is first subjected to burning at temperatures of 835&#xb0; C. to 840&#xb0; C. for 100 hours, then pressurization, and further burning at temperatures of 835&#xb0; C. to 840&#xb0; C. for 100 hours, thereby preparing an oxide superconductor thick film having a film thickness of 130 &#x3bc;m or more having a high Jc and Ic.

Method of manufacturing oxide superconductor thick film

The present invention provides an oxide superconductor thick film which is formed on a substrate or a board and has a high Jc and Ic and a method for manufacturing the same. Predetermined amounts of materials containing elements of Bi, Pb, Sr, Ca and Cu are weighed, mixed and subjected to steps of calcining, milling, and drying, and thereafter an organic binder and an organic vehicle are added thereto to prepare a (Bi, Pb) Sr Ca Cu O , superconductive paste, which is applied to the surface of a substrate or a board in a thickness of 260 &mgr;m or more and dried. Thereafter, the paste is first subjected to burning at temperatures of 835&deg; C. to 840&deg; C. for 100 hours, then pressurization, and further burning at temperatures of 835&deg; C. to 840&deg; C. for 100 hours, thereby preparing an oxide superconductor thick film having a film thickness of 130 &mgr;m or more having a high Jc and Ic.

Growing community of inventors

Tokyo, Japan

Masakazu Kawahara