Tdk Corporation

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Masakazu Kamoshida

Hiroshi Yagi

Sho Masujima

Atsuzo Tamashima

Keiichi Ihara

A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series. When respective electronic circuit elements are removed from the electronic circuit element series, the adhesive means sticking to the respective electronic circuit elements are adapted to be also removed from the series. The adhesive means sticking to the respective electronic circuit elements are then heated, through which adhesive means have exhibited adhesion due to heating the respective electronic circuit elements are provisionally held on a printed circuit board. Also, a method of manufacturing an electronic circuit element series is disclosed.

Carrier tape for electronic circuit elements and method of manufacturing

A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.

Method of mounting surface-mounted type electronic components on a

An apparatus for storing and supplying parallel lead circuit elements that are secured to an elongated web is provided. The apparatus is adapted to supply the parallel lead circuit elements to a mechanism particularly adapted to process and secure the parallel lead electronic circuit elements to a printed circuit board. Storage and supply of the electronic circuit elements is affected by winding each of the webs carrying the parallel lead circuit elements about a reel, which reel is enclosed in a case. The apparatus is adapted to support each of the cases at predetermined positions and further dispose appropriate guiding and feeding structure proximate to each of the cases to effect guiding and feeding of each of the webs to the mechanism for processing and securing the parallel lead electronic circuit elements to a printed circuit board.

Growing community of inventors

Tokyo, Japan

Masakazu Kamoshida