Sumitomo Chemical Company, Limited

The Yomiuri Shimbun

Masakazu Inoue

Kuniaki Asai

Kazuo Hieda

Yoshiharu Tatsukami

Yasuro Suzuki

Shigeyoshi Matsubara

Tadayasu Kobayashi

Nobuo Fukushima

Kazunori Furukawa

Motomu Wada

Ryouzo Takai

Kozo Hotta

Resin composition

A resin composition for printed circuit board comprising:

Resin composition for printed circuit board

An aromatic polysulfone resin composition with excellent plating characteristics comprising:

Aromatic polysulfone resin composition having excellent plating

In a method for the preparation of crosslinked polyolefin foams by charging a polyolefin or its blend with other thermoplastic resins containing a crosslinking agent, foaming agent and if necessary a filler into the heated mold having a changeable cavity and, after decomposition of the crosslinking and foaming agents, retracting the moving-plate of the mold by a definite distance to increase the cavity and at the same time cooling the mold, an improvement for the preparation of the crosslinked polyolefin foams having excellent appearance and dimensional stability, comprising using a mold of which the moving-plate is constructed with a body and a sliding-piece, the body holding the piece slidably whereby the sliding-piece is left behind owing to sliding between the two even on rapid retraction of the body and then retracts at the rate corresponding to the foaming pressure of the resin, in other words, at a self-controllable rate and the mold for the preparation thereof. Furthermore an improvement using a mold of which the side-plate is constructed with a body and a piece which is freely attachable to or removable from the body, and the mold. And both the sliding-piece and the side-plate piece are exchangeable in order to change the mode of the molded products.

Preparation of crosslinked polyolefin foams and the mold

When a thermoplastic resin sheet such as polyethylene, polypropylene, polystyrene, ABS or polyvinyl chloride resin sheet which contains 0 - 80 % by weight of an inorganic filler and has a foaming ratio (a) of 1 or 1 &lt; a .ltoreq. 4 and which satisfies the relation 130 .gtoreq. 20a + b .gtoreq. 30 (wherein 'a' is the foaming ratio and 'b' is amount of the inorganic filler) is pressed onto a matrix in such a manner that the thickness of said resin sheet before pressing is larger than the thickness of the convex portions of the resultant resin relief plate, thus obtained relief plate has excellent printability.

Method for preparing a plastic relief printing plate

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Koka, Japan

Masakazu Inoue