Mitsubishi Electric Corporation

Masakazu Hamada

Takashi Nagao

Katsuhiko Omae

Takanobu Kajihara

Atsuki Fujita

Ryosuke Takeshita

In a semiconductor device, on a heat dissipation portion of a lead frame opposite to a mounting portion on which a semiconductor element is mounted, a thin molding portion having a thickness of about 0.02 mm to 0.3 mm is formed by a second molding resin which is a high-heat-dissipation resin. A scale-like portion on which scale-shaped projections are consecutively formed is provided over both sides across a resin boundary portion of the heat dissipation portion. The scale-like portion reaches abutting surfaces of an upper die and a lower die of a mold used in a molding process. Thus, the same void inhibition effect as with an air vent is obtained.

Growing community of inventors

Tokyo, Japan

Masakazu Hamada