Sanyo Denki Co., Ltd.

Ando Electric Company

Masakazu Chikyu

Toshihito Miyashita

Hiroshi Hioki

A circuit substrate for connection is used as a connecting member for electrically connecting a stator disposed inside a casing and a plurality of electric cables disposed outside the casing. A circuit substrate for connection is supported by a connecting member attachment. The connecting member attachment is molded using a circuit substrate for connection and a receptacle as inserts. Then, the circuit substrate for connection is disposed to pass through a wall portion of the casing in a thickness direction of the wall portion. The connecting member attachment is fixed onto the casing. Thus, the electric cables may be connected to the outside of the casing with a low-priced connecting structure.

Connecting structure for electric cables and electric apparatus

A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.

Heat radiation structure of electric apparatus

A molded motor is provided that allows for ready installation of a heat-conducting member therein and is capable of improving dissipation of heat generated from the stator. The heat-conducting member is integrally formed with a load-side end bracket. The heat-conducting member includes a stopper surface that contacts an end surface of a stator core in the axial direction of a shaft, and an extended portion extending from the stopper surface toward a non-load-side end bracket to contact an outer peripheral surface of the stator core. The heat-conducting member is embedded in a molded portion with the stopper surface contacting the end surface of the stator core and the extended portion contacting the outer peripheral surface of the stator core.

Molded motor

A relay control circuit is provided to perform on/off control on multiple kinds of relays, each having a different operation speed, which are contained in a source-voltage supply circuit which is employed by an IC tester to perform DC-parameter measurement on ICs. The relay control circuit contains a timer-A and a timer-B, to which different relay-operation wait times are arbitrarily set, wherein the timer-A is set in response to a relay whose operation speed is slowest within the multiple kinds of relays. When a test instruction is executed in accordance with a test program, relay-select-information, representing at least one of the multiple kinds of relays, is generated. A relay-operation monitoring circuit, contained in the relay control circuit, monitors a driving relay by detecting coincidence between current relay-select-information, regarding a current test, and previous relay-select-information regarding a previous test. Both of the timers operate in response to a relay-on signal with respect to the driving relay. However, the timer-A is started only when the relay-operation monitoring circuit fails to detect the coincidence. An OR gate produces a relay-operation-wait control signal based on outputs of the timers, which represents a wait time for an operation of the driving relay. In short, one of the timers is selectively driven in conformity with an operation speed of the driving relay. This results in reduction of a test time for the IC tester.

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Nagano, Japan

Masakazu Chikyu