Toyoda Gosei Co., Ltd.

Kabushiki Kaisha Toshiba

Masakata Koseki

Makoto Sato

Yuichi Yano

Hiroyuki Tajima

Satoshi Wada

Hiroaki Oshio

Kazuhiro Tamura

Eiki Kawano

Takeshi Matsushima

Satoshi Ota

Hiroko Tsukamoto

Akio Namiki

Tatsuichiro Maki

Tomoko Suzuki

A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a phosphor-containing film on the plurality of light-emitting elements directly or via a transparent adhesive layer, a transparent plate provided on the phosphor-containing film so as to directly contact the film, and a white reflector to cover a side surface of the plurality of light-emitting elements and, of side surfaces of the phosphor-containing film, at least a side surface not located above a gap between the plurality of light-emitting elements. At least a portion of a region directly above the gap is not covered with the phosphor-containing film.

Light-emitting device and method of manufacturing the same

The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the LED chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the LED chip by 80&#xb0; C. or more exists at a boundary surface between an inner wall surface of the case and the sealant or within 300 &#x3bc;m of the boundary surface.

Light-emitting device including case and sealant

A light-emitting device includes a light-emitting element, and a sealing material for sealing the light-emitting element. The sealing material includes a first layer including a radical polymerizable resin and a second layer including a non-radical polymerizable resin, the first layer being in contact with the light-emitting element and the second layer covering an upper surface of the first layer.

Light-emitting device

A light-emitting device includes an LED chip, and a case including a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip. The case further includes a resin that includes a glass fiber and is integrally formed by injection molding. An average length of the glass fiber is greater than a thickness of the sidewall portion. The resin has a refractive index different from the glass fiber.

Light-emitting device including LED chip and a case having resin and glass fiber

A light-emitting device includes a light-emitting element mounted on a lead frame, and a sealing material sealing the light-emitting element and having a thickness of not more than 1 mm and including a silicone resin as a main component. The sealing material includes a first gas barrier layer that a physical property value obtained by dividing a difference between a value of an average spin-spin relaxation time ofH nuclei at a resonance frequency of 25 MHz at 140&#xb0; C. and that at 25&#xb0; C. by 115 is not more than 3.5 and the average spin-spin relaxation time at 140&#xb0; C. is not more than 500 &#x3bc;sec.

Sealing material for light-emitting device having gas barrier property

A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.

Light emitting device including a case having an accommodating recession

A light emitting device includes a light emitting element, a sealing material for sealing the light emitting element, a first filler included in the sealing material, and a second filler included in the sealing material. The second filler includes a particle diameter smaller than that of the first filler.

Light emitting device

A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

Growing community of inventors

Kiyosu, Japan

Masakata Koseki