Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Minnesota Mining and Manufacturing Company

Masaji Yoshimura

Kazuharu Kanezaki

Takashi Satoh

Toru Ueki

Hiroyasu Kido

Minoru Takiguchi

Shoji Tamai

Yasunori Yoshida

Hideaki Oikawa

Susumu Kishi

Kayako Yanagihara

Ineo Iwata

Tomoyuki Nakata

Yuichi Okawa

Takashi Kuroki

Yoshihiro Sakata

Atsushi Shibuya

Atsushi Morita

Tomohito Koba

Denis D Springer

Kenji Sakata

Kouichi Sano

Tomomi Okumura

Tomoaki Sato

Daniel Patrick Sheehy

A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding. {circle around (2)} It has high heat resistance. {circle around (3)} It is superior in productivity. {circle around (4)} It is superior in dimensional accuracy.

Crystalline polyimide for melt molding with satisfactory thermal stability

A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230.degree. C. or more, for example, a temperature of 230 to 300.degree. C., or 230 to 250.degree. C.

Polyimide resin composition

A resin composition containing components (A), (B), (C) and (D) wherein component (A) is a resin composition containing a thermoplastic polyimide resin, component (B) is carbon fiber, component (C) is mica, component (D) is an internal mold-releasing agent, and relative to 100 parts by weight of component (A), component (B) is from 1 to 80 parts by weight, component (C) 1 to 100 parts by weight, and component (D) is 0.1 to 50 parts by weight.

Resin composition and heat-resistant, returnable IC tray obtained by

A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B' type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.

Polyphenylene ether resin compositions comprising copolymers of

Polyphenylene ether resin composition

Modified polyolefin resin compositions

A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises:

Conductive resin composition

A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.

Molding material for electroconductive IC parts

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Kanagawa, Japan

Masaji Yoshimura