Daikin Industries, Ltd.

Teijin Limited

Tsinghua University

Masaji Komori

Tsuyoshi Miyamori

Tetsuo Shimizu

Hideki Kono

Masami Kato

Takayuki Araki

Taketo Kato

Masahiro Kumegawa

Hirokazu Komori

Koji Nakanishi

Yuki Ueda

Toshiyuki Miyake

Junpei Terada

Hiroyuki Yoshimoto

Takuya Arase

Ayane Nakaue

Shunsuke Okuzawa

Hirofumi Mukae

Yoshito Tanaka

Hiroshi Ito

Yoshihisa Yamamoto

Xuming Xie

Shuhei Yamaguchi

Masami Katoh

A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.

Fluororesin composition, fluororesin sheet, laminate and substrate for circuits

Provided are a fluororesin-containing composition having significantly improved fluidity and a method for producing the same. The fluororesin-containing composition contains 99.99 to 97% by mass of a fluororesin having a melting point of 205° C. to 225° C. and 0.01 to 2% by mass of a thermotropic liquid crystal polymer. The method for producing the fluororesin-containing composition includes kneading polychlorotrifluoroethylene and a thermotropic liquid crystal polymer at 285° C. to 320° C.

Fluorine-containing resin composition and method for production thereof

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board

A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.

Resin composition and molded article

A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.

Resin composition and molded body

The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280&#xb0; C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300&#xb0; C., and has a 5% weight loss temperature of 470&#xb0; C. or higher as measured by TGA (thermal gravimetric analysis).

Reinforced polycarbonate resin composition

A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 &#x3bc;m.

Resin composition including a polycarbonate resin and a fluorine-containing polymer, and molded article

A method for producing a regenerated fluororesin, characterized in that it comprises subjecting a used melt-molded fluororesin article to a heat treatment at a temperature of from room temperature to the melting point of the resin; a method for producing a regenerated fluororesin, characterized in that it comprises subjecting a used melt-molded fluororesin article to a supercritical washing treatment at a temperature of from room temperature to the melting point of the resin; and a regenerated fluororesin article containing substantially no impurities which is obtainable by the above method.

Method for producing regenerated fluororesin and regenerated fluororesin article

The structural member of the present invention comprises (A) a layer which comprises a fluorine-containing polymer and does not contain an adhesive material other than the fluorine-containing polymer substantially and (B) a substrate, in which the layer (A) is adhered directly to the substrate (B) without interposing a binder therebetween and a longitudinal shear strength between the layer (A) comprising a fluorine-containing polymer and the substrate (B) is not less than 0.98 N/mm at 150&deg; C. The structural member comprising a fluorine-containing polymer and a substrate adhered to each other, particularly the structural member having improved adhesive strength at high temperature and the sliding material produced by using the structural member are provided.

Structural member of fluorine-containing polymer having adhesive property at high temperature and sliding material produced by using same

Resin composition

An injection moldable fluorine-containing meltable resin composition comprising 70 to 98 wt. % of a fluorine-containing meltable resin, and 2 to 30 wt. % of a needle-shape material having an average diameter of 3 &mgr;m or less, an average aspect ratio of between 10 and 100, and Mohs hardness of between 5 and 8, which composition has good sliding and sealing properties and excellent moldability, in particular, moldability of thin wall articles.

Fluorine-containing meltable resin composition

To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ/mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.

Fluorine-containing resin composition for parts of electronic and electrical equipment and same parts

Resin composition, molded article produced from same and method for producing molded article

A non-sticking sliding part molding Composition comprising a mixture of a fluororesin and a thermoplastic resin other than fluororesin and a fibrous filler, said mixture and said fibrous filler accounting for 70 to 95 weight % and 5 to 30 weight %, respectively, and said thermoplastic resin other than fluororesin occurring in a proportion of 60 to 100 parts by weight based on t00 parts by weight of said fluororesin. The object is to provide a non-sticking sliding part molding composition which is not only fully possessed of the fundamental properties required of sliding parts but also has a well-balanced assortment of hardness, deflection under load, creep resistance, slidability, moldability, and toner-repellent property, thus surpassing the prior art.

Growing community of inventors

Settsu, Japan

Masaji Komori