Polymatech Co., Ltd.

Masahumi Yamato

Shinya Tateda

Tsunehisa Kimura

Masayuki Tobita

Tobita Masayuki

Tsuneh Isa Kimura

Tsunehisa Excel Heights 301 Kimura

Masayuki R&D Center Of Polymatch Co Ltd Tobita

Shinya R&D Center Of Polymatch Co Ltd Tateda

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device, power source, light source or other components used for the electric products, and an electronic component excellent in radiation.

Adhesion method and electronic component

A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.

Heat conductive mold and manufacturing method thereof

A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.

Heat conductive adhesive film and manufacturing method thereof and electronic component

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device , power source , light source or other components used for the electric products, and an electronic component excellent in radiation.

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Chohu, Japan

Masahumi Yamato