Hitachi, Ltd.

Other

Hitachi Ulsi Engineering Corp.

Hitachi Tohbu Semiconductor, Ltd.

Renesas Technology Corp.

Hitachi Vlsi Engineering Corp.

Trecenti Technologies, Inc.

Masahito Takahashi

Takeshi Furuno

Masashi Wada

Akihiko Satoh

Kazunori Furusawa

Michiko Odagiri

Masataka Kato

Kazuo Nakazato

Fukuo Owada

Shiro Akamatsu

Teruaki Kisu

Shuji Ikeda

Hideo Miura

Hideki Tanaka

Norio Suzuki

Hiroyuki Ohta

Tomio Iwasaki

Hiroshi Sato

Norio Ishitsuka

Takayuki Yoshitake

Hiroyuki Mima

Takeshi Nakamura

To suppress defects occurred in a semiconductor substrate, a semiconductor device is constituted by having: the semiconductor substrate; an element isolating region having a trench formed in the semiconductor substrate and an embedding insulating film which is embedded into the trench; an active region formed adjacent to the element isolating region, in which a gate insulating film is formed and a gate electrode is formed on the gate insulating film; and a region formed in such a manner that at least a portion of the gate electrode is positioned on the element isolating region, and a first edge surface of an upper side of the embedding insulating film in a first element isolating region where the gate electrode is positioned is located above a second edge surface of the embedding insulating film in a second element isolating region where the gate electrode film is not positioned.

Semiconductor device and manufacturing method of the same

Disclosed are a gain cell structure capable of making a memory cell compact in size and a method of manufacturing the same at low cost. A memory cell is constituted of a reading MIS transistor and a writing MIS transistor. The reading MIS transistor has a pair of n type semiconductor regions (source region and drain region) formed on a main surface of a semiconductor substrate and a first gate electrode formed on a path of the n type semiconductor regions via a first gate insulating film. The writing MIS transistor is arranged on the reading MIS transistor and has a layered structure made by laminating a lower semiconductor layer (source region), an intermediate semiconductor layer (channel forming region), and an upper semiconductor layer (drain region) in this order. The writing MIS transistor has a vertical structure in which a second gate electrode is arranged on both sidewalls of the layered structure via a second gate insulating film.

Method of manufacturing semiconductor memory device and semiconductor memory device

It is possible to suppress or prevent so-called write disturbance phenomenon from occurring in write-disabled non-selected memory cells in a semiconductor device, in any selected one of which data can be written electrically by means of the so-called tunneling phenomenon. In a flash memory that can disable writing of data by suppressing injection of electrons in the accumulation layer of each non-selected memory cell in which data is to be written with a writing disable voltage applied to the drain thereof before a write voltage is applied to the control gate electrode of each selected memory cell, the relationship among a writing disable voltage Vwd, a read voltage Vr applied to the drain of a selected memory cell from which data is to be read, and a punch-through withstand voltage BVds between the source and the drain of each selected memory cell is set to satisfy Vr<BVds<Vwd.

Semiconductor device and a integrated circuit card

The present invention aims to provide high integration of a nonvolatile semiconductor memory device having lots of flash memory cells without causing a reduction in its operating speed. A width taken along a gate-width direction, of a lower conductor film for a floating gate electrode is made thinner than a minimum processing size F, and a width taken along the gate-width direction, of an upper conductor film for the floating gate electrode, which is provided with an insulating film disposed on source and drain regions interposed therebetween, is made thicker than the minimum processing size F, whereby a reduction in the ratio of coupling between a control gate electrode and a floating gate electrode due to the scaling down of a unit cell area is restrained.

Nonvolatile semiconductor memory device and a method of manufacturing the same

Semiconductor memory device with MIS transistors

A gate electrode of a field-effect transistor used as a peripheral circuit is constituted by the same gate electrode structure as a double-level gate electrode structure of nonvolatile memory cells, and a contact hole for connecting those conductive films constituting the gate electrode is provided at a location which two-dimensionally overlaps an active area within a plane of the gate electrode. A hole for connecting between the two layers of the gate electrode of a first field-effect transistor used as perpheral circuit is provided at a location which two-dimensionally overlaps the active area within the plane of the gate electrode, and a hole for connecting between the two layers of the gate electrode of a second field-effect transistor used as a peripheral circuit is provided at a location which two-dimensionally overlaps an isolation area within the plane of the gate electrode. The gate length of the first field-effect transistor is longer than the gate length of the second field-effect transistor, and the gate width of the first field-effect transistor is wider than the gate width of the second field-effect transistor.

method for forming capacitors and field effect transistors in a semiconductor integrated circuit device

A gate electrode of a field-effect transistor used as a peripheral circuit is constituted by the same gate electrode structure as a double-level gate electrode structure of nonvolatile memory cells. A hole for connecting the two layers of the gate electrode of a first field-effect transistor used as peripheral circuit is provided at a location which two-dimensionally overlaps the active area within the plane of the gate electrode, and a hole for connecting the two layers of the gate electrode of a second field-effect transistor used as a peripheral circuit is provided at a location which two-dimensionally overlaps an isolation area within the plane of the gate electrode. The gate length of the first field-effect transistor is longer than the gate length of the second field-effect transistor, and the gate width of the first field-effect transistor is wider than the gate width of the second field-effect transistor.

Semiconductor integrated circuit device

A batch erasable single chip nonvolatile memory device and a method therefor of using the same provided with memory cells which are adapted to execute an erase operation by ejecting an electric charge, accumulated at floating gates by a program operation (including a pre-write operation) carries out, in sequence a first operation for reading memory cells of an erase unit and carrying out a pre-write operation on those nonvolatile memory cells at the floating gates of which electric charge is not stored, a second operation for carrying out a batch erase operation at a high speed for the nonvolatile memory cells of said erase unit with a relatively large energy under a relatively large erase reference voltage, a third operation for carrying out a read operation of said all erased nonvolatile memory cells and a write operation on those nonvolatile memory cells which are adapted to have a relatively low threshold voltage, and a fourth operation for carrying out a batch erase operation at a low speed for the nonvolatile memory cells of said erase unit with a relatively small energy under a relatively small erase reference voltages, or is provided with an automatic erasing circuit for executing these operations.

Batch erasable single chip nonvolatile memory device and erasing method

A batch erasable nonvolatile memory device and an apparatus using the same provided with memory cells which are adapted to execute an erase operation by ejecting an electric charge, accumulated at floating gates by a program operation (including a pre-write operation), carries out, in sequence, a first operation for reading memory cells of an erase unit and carrying out a pre-write operation on those nonvolatile memory cells at the floating gates of which electric charge is not stored, a second operation for carrying out a batch erase operation at a high speed for the nonvolatile memory cells of said erase unit with a relatively large energy under a relatively large erase reference voltage, a third operation for carrying out a read operation of said all erased nonvolatile memory cells and a write operation on those nonvolatile memory cells which are adapted to have a relatively low threshold voltage, and a fourth operation for carrying out a batch erase operation at a low speed for the nonvolatile memory cells of said erase unit with a relatively small energy under a relatively small erase reference voltage, or is provided with an automatic erasing circuit for executing these operations.

Batch erasable nonvolatile memory device and erasing method

A batch erasable nonvolatile memory device and an apparatus using the same provided with memory cells which are adapted to execute an erase operation by a ejecting an electric charge accumulated at floating gates by program operation (including a pre-write operation), carries out, in sequence, a first operation for reading memory cells of an erase unit and carrying out a pre-write operation on those nonvolatile memory cells at the floating gates of which electric charge is not stored, a second operation for carrying out a batch erase operation at a high speed for the nonvolatile memory cells of said erase unit with a relatively large energy under a relatively large erase reference voltage, a third operation for carrying out a read operation of said all erased nonvolatile memory cells and a write operation on those nonvolatile memory cells which are adapted to have a relatively low threshold voltage, and a fourth operation for carrying out a batch erase operation at a low speed for the nonvolatile memory cells of said erase unit with a relatively small energy under a relatively small erase reference voltage, or is provided with an automatic erasing circuit for executing these operations.

Two paths for receiving the outputs of a logic select circuit LOGS are individually equipped in a symmetric manner with output MOSFETs Q52 and Q53, feedback MOSFETs Q54 and Q55 and isolating MOSFETs Q56 and Q57, the paired of which have conduction types different from each other. Negative erasing Vee voltage and programming Vpp voltage to be fed to the paths through the feedback MOSFETs are prevented without fail from being transmitted to a logic select circuit by the paired isolating MOSFETs of the different conduction types. As the elements for selecting the positive or negative logic output of the logic select circuit, CMOS transfer gates TG1 and TG2 can be adopted to maximize the amplitude of the output logic signal of the logic select circuit with respect to an operating power.

Growing community of inventors

Tachikawa, Japan

Masahito Takahashi