Asahi Kasei Kabushiki Kaisha

Asahi Kasei Kogyo Kabushiki Kaisha

Asahi Kasei Chemicals Corporation

Masahito Kuramitsu

Miki Tokuyama

Toru Yamaguchi

Yuji Tanaka

Hiroshi Oyamada

Hiroshi Shirai

Yoshimasa Matsuura

Eiko Kobayashi

Jun Yonezawa

Kimihiro Kubo

Yuko Fukuoka

Nobuyoshi Umeniwa

The thermoplastic resin composition includes a polyphenylene ether resin, and the deflection temperature under load of the thermoplastic resin composition is 120° C. or higher, and when a temperature range while the thermoplastic resin composition is heated from −30° C. to 120° C. is divided into temperature ranges with intervals of 10° C., and a low temperature side and a high temperature side of respective two adjacent temperature ranges are defined as a low temperature range and a high temperature range, respectively, a low temperature range expansion coefficient of the resin composition in a TD direction (mm/mm/° C.) and a high temperature range expansion coefficient of the resin composition in the TD direction (mm/mm/° C.) satisfy the following relationship in any of the two adjacent temperature ranges: −50≤((high temperature range expansion coefficient−low temperature range expansion coefficient)/low temperature range expansion coefficient)×100≤50.

Antenna member

The present disclosure is directed to a component for a telecommunication apparatus, the component comprising a molded product made of a resin composition. The resin composition comprises (a) a matrix resin and (b) titanium dioxide. The (A) matrix resin comprises (A-a) a polyphenylene ether-based resin. The sum of the contents of the (A-a) polyphenylene ether-based resin, and (A-b) a block copolymer containing at least one block mainly composed of an aromatic vinyl monomer unit and at least one block mainly composed of a conjugated diene monomer unit and/or a hydrogenated product of the block copolymer with respect to 100 parts by mass of the (A) matrix resin is 75 parts by mass or more. The average L/D of the (B) titanium dioxide is 1.2 or more and 6.0 or less, and the content of titanium dioxide having an L/D of greater than 7.0 is less than 10%.

Component for telecommunication apparatus

Provided is a polyphenylene ether resin composition having excellent mechanical properties, such as tensile, flexural, and impact strength, high flame retardance, and adequate molding fluidity, and that is sufficiently resistant to use as a thin molded article for an electric/electronic device cooling fan, etc. The polyphenylene ether resin composition contains at least 90 mass % of a polyphenylene ether (A), a styrene resin (B), glass fiber (C), and an organophosphorus flame retardant (D) in terms of total mass of (A) to (D). Taking this total mass as 100 mass %, contents of the polyphenylene ether (A), styrene resin (B), glass fiber (C), and organophosphorus flame retardant (D) are 25-75 mass %, 0-5 mass %, 20-50 mass %, and 5-20 mass %, respectively, and taking mass of the organophosphorus flame retardant (D) as 100 mass %, content of at least one compound selected from the group consisting of triphenyl phosphate and a phosphazene is at least 70 mass %.

Polyphenylene ether resin composition and molded article and method for producing polyphenylene ether resin composition

An optical material having a high birefringence and a small absolute value of a photoelastic coefficient is provided by use of a resin composition for an optical material comprising a resin (a) having a positive photoelastic coefficient and a negative inherent birefringence and a resin (b) having a negative photoelastic coefficient and a negative inherent birefringence.

Resin composition for optical material

An injection compression molding method is characterized in that a resin is injected from a resin gate provided near a recess portion of a mold corresponding to a thick rib portion, gas is injected from the thick rib portion before the mold is closed and compressed, and thereafter the resin is made to flow back from the resin gate to an injection nozzle while the mold is closed and compressed.

Injection compression molding method

Growing community of inventors

Tokyo, Japan

Masahito Kuramitsu