Mitsuboshi Belting Ltd.

Okuno Chemical Industries Co., Ltd.

Masahito Kawahara

Yoshio Yamaguchi

Toru Noguchi

Kazuo Goto

Shigehito Deki

Susumu Murakami

Yoshito Nokami

Sigehiko Hayashi

Yoshifumi Yamashita

Shigehiko Hayashi

Koichi Sayo

Masayuki Ogino

Hiroshi Yanagimoto

A method of forming a conductive circuit pattern on a circuit board having a first region, on which a desired conductive circuit pattern is to be formed, and a second region. The method includes the step of applying a coating including a solution with conductive particles to the circuit board. The coating is heated to adhere the conductive particles to the circuit board. The conductive particles are removed in the second region. The second region is shielded and, with the second region shielded, a conductive film is formed on the first region.

Method of forming a conductive pattern on a circuit board

A layer is provided for bonding a conductive plating to a substrate which substrate normally does not provide firm bonding of plating directly thereto. The bonding layer forms a matrix in which are dispersed ultrafine metal particles. The bonding layer is formed in situ on the substrate surface with the metal particles being maintained unaggregated in the matrix as it is formed on the surface. Plating subsequently formed on the outer surface of the bonding layer is effectively firmly bonded to the substrate through the intermediary of the matrix and metal particles distributed therein. The bonding layer includes a fixative formed of an organic compound including a metal and an organic solvent. The bonding layer may further include a film strengthener.

Surface treating agent for plating and base material with the plating adhered thereto

A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the weight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.

Copper conductor paste and production method of copper conductor film

A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the wight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.

A particle dispersed glassy material includes ultrafine metal particles that are present in a high concentration. The particles are surrounded by a fixation component and, optionally, can be surrounded by a skeleton forming component. The glassy material is produced by firing a substrate having a film thereon that includes a polymer composite having the ultrafine particles uniformly dispersed therein, a fixation reagent and, optionally, a skeleton forming reagent under relatively mild conditions that do not damage the substrate. A method of making the glassy material includes the steps of making a film-forming composition that includes the polymer composite, the fixation reagent and, optionally, the skeleton forming reagent, applying the composition to a substrate, drying the applied composition to produce a film and firing the film to produce the glassy material.

Ultrafine particle dispersed glassy material and method

A polymer composite contains colorant molecules dispersed therein. The colorant molecules can be dispersed in the polymer or bound to the polymer molecules. When the polymer is a polyamide, the polyamide is in a noncrystalline state due to the inhibition of crystallization imparted by the size and shape of the colorant molecules because the colorant is separated on a molecular level. A high colorant availability is obtained. A method of producing the polymer composite includes the steps of forming a metastable polymer resin layer, applying a film of colorant to the layer, stabilizing the layer, dissolving the stable layer in a solvent, aspirating the solution to remove impurities and aggregates and then removing the solvent. A polymer composition can be produced by mixing the polymer composite with a polymer.

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Osaka, Japan

Masahito Kawahara