Panasonic Corporation

Masahito Kawabata

Yoshihito Fujiwara

The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other. A circuit board connecting structureincludes a first circuit board, and a second circuit board. The circuit board connecting structureis configured so that when a first connecting portionand a second connecting portionare sandwiched by a pair of pressing jigsand are press-contacted with each other, oneof first outer dummy terminals is accommodated between columns of onesof second outer dummy terminals, while the other first outer dummy terminalis accommodated between columns of the other onesof the second outer dummy terminals.

Circuit board connecting structure

The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structureof a circuit board comprises a first circuit boardand a second circuit board, with a first connecting partand a second connecting partopposedly disposed via an adhesive. The first connecting partand the second connecting partare pinched by a pair of pressurizing jigsand subjected to hot pressure welding so that first circuit patternsand second circuit patternsare in contact with each other. In the connecting structureof the circuit board, the first circuit boardis a soft base material, and a heat-insulating layer, having lower thermal conductivity than the soft base material, is provided on only a partof the region corresponding to the first connecting parton the rear surfaceB of the soft base material

Connecting structure of circuit board, connecting part of circuit board and electronic device

An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods. A flip chip packaging structure is formed by directly connecting a first semiconductor chip () reduced in thickness by back grinding and a substrate () via a bump electrode () to a wiring pattern (). Also, a second semiconductor chip () is formed with an electrode () that is higher than the sum of the thickness of the first semiconductor chip () and the height of the electrode (), and the electrode () is directly connected to the wiring pattern () on the substrate (), whereby the most-compact three-dimensional semiconductor packaged device is produced.

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Kanagawa, Japan

Masahito Kawabata