Screen Holdings Co., Ltd.

Screen Semiconductor Solutions Co., Ltd.

Sokudo Co., Ltd.

Masahito Kashiyama

Koji Nishiyama

Hiroyuki Ogura

Toru Momma

Shogo Yoshida

Shoji Kirita

Junki Nishimura

Hidetoshi Sagawa

Kota Kabune

Joji Kuwahara

Yukihiko Inagaki

Akihiko Morita

Hiroyuki Takeuchi

Shigehiro Goto

Tomohiro Matsuo

Satoshi Yamamoto

Takashi Taguchi

Kazuya Akiyama

Tomohiro Goto

Noriaki Yokono

Yasuo Takahashi

Kohei Iwasaki

Isao Taniguchi

Toshiya Kuwahara

Chiho Harayama

A treating solution supply apparatus which supplies a treating solution for treating a substrate includes a liquid passage for allowing the treating solution to flow therethrough; and a pump including a chamber with a variable volume for receiving and feeding the treating solution from/to the liquid passage, and a chamber driver electrically driven to vary the volume of the chamber. The liquid passage, chamber, and chamber driver are arranged in the stated order laterally.

Treating solution supply apparatus

Disclosed is a filter coupling device having joint members, a base plate, a filter holder, a rotation shaft, and a leg. The filter holder allows support of a first filter and a second filter. The rotation shaft is connected with the filter holder. The filter holder takes a first attitude and a second attitude by rotating around the rotation shaft. The filter holder includes a first filter holder configured to support the first filter in the first attitude, and a second filter holder configured to support the second filter in the second attitude.

Filter coupling device and substrate treating apparatus provided therewith

Disclosed is a substrate treating apparatus that treats a substrate with processing liquids. The apparatus includes a substrate holder, an exterior cup, and an interior cup. The interior cup includes an interior cup body, and an interior cup outlet. The exterior cup includes an exterior cup body, an exterior bottom cup, a first drain outlet, a first exhaust port, a second drain outlet, a second exhaust port, and a separation partition. The apparatus further includes an annular member movable upwardly/downwardly, and a drive unit that causes the annular member to move to shift the interior cup body between a collecting position and a retracting position.

Substrate treating apparatus

A chamber has a first opening, a second opening, and a third opening. The second opening is higher in level than the first and third openings, and is located at the highest position of a reservoir. Air bubbles are easily collected around the second opening, higher in level than the third opening, due to buoyancy. Moreover, the chamber includes an upper slope on an upper inner wall thereof such that a sectional area of the chamber becomes smaller toward the highest position of the reservoir. The upper slope causes the air bubbles not to stagnate but to be guided to the second opening along the upper slope. This makes easy discharge of the air bubbles from the chamber.

Pumping apparatus, treatment solution supplying device, and substrate treating apparatus

A chamber has at least three openings, or a first opening, a second opening, and a third opening formed therein that are in communication with a reservoir. The second opening is higher in level than the first opening. The third opening is used for discharging a liquid within the reservoir by introducing gas through at least one of the first opening and the second opening into the reservoir. Since the third opening is the lowest in level among the three openings, the liquid stored in the reservoir is able to be drained easily.

Pumping apparatus, treatment solution supplying device, substrate treating apparatus, liquid draining method, and liquid replacing method

A development liquid is discharged from a development liquid nozzle having one discharge port extending continuously in one direction to the substrate. The development liquid nozzle is fixed such that the development liquid is supplied to a reference straight line on an upper surface of the substrate, and is fixed such that a liquid receiving region that receives the development liquid on the upper surface of the substrate extends in a direction inclined with respect to the reference straight line, the reference straight line passing through a rotational center of the substrate. The development liquid nozzle is moved in a direction of the reference straight line. The liquid receiving region has one end and another end. The other end is located farther away from the rotational center of the substrate than the one end, and is located farther downstream in the rotation direction of the substrate than the one end.

Liquid processing apparatus and liquid processing method

Disclosed is a substrate treating apparatus including a substrate holder, a rotating drive unit, a treatment liquid supplying unit, an exterior cup, and an interior cup. The interior cup is movable between a collection position where the interior cup collects the treatment liquid and a retracting position where the exterior cup collects the treatment liquid, and includes an interior cup main body with an annular contour, a liquid outlet in the interior cup main body for draining the treatment liquid in the interior cup main body, and an exhaust port in the interior cup main body for exhausting gas in the interior cup main body. The exterior cup includes an exterior cup main body with an annular contour, a liquid outlet in the exterior cup main body for draining the treatment liquid in the exterior cup main body, and an exhaust port in the exterior cup main body for exhausting gas in the exterior cup main body.

Substrate treating apparatus and substrate treating method

A drive mechanism deforms two diaphragms to perform alternate increase and decrease in volume of a supply chamber. At this time, the two diaphragms are provided for the single supply chamber. This leads to possibility of suction and feed out of a desired amount of liquid even with limited deformation of the diaphragms. In addition, the two diaphragms achieve suppression in deformation thereof upon suction and feed out of a desired amount of liquid. This allows selection of the diaphragms each with a short stroke, yielding suppressed stagnation and quality degradation of the liquid.

Pump apparatus and substrate treating apparatus

A pumping apparatus includes a pump chamber, a piston, a motor, and a controller. The controller determines an imaginary terminal point by referring to a dispense command, theoretical information, and a current position of the piston. The controller corrects the imaginary terminal point to a target position by referring to a correction graph. The controller outputs a drive command to the motor for moving the piston from a start position to the target position.

Pumping apparatus and substrate treating apparatus

A filter coupling device couples to a filter. The filter coupling device includes a plurality of joint members for connection to a plurality of connection openings of the filter. The filter coupling device also includes an arrangement switcher for switching an arrangement of the joint members between a first arrangement and a second arrangement.

Filter coupling device and a substrate treating apparatus having same

Provided is a pump apparatus, having an upstream pump, a filter, and a downstream pump being inserted into a processing liquid flow path in this order. The downstream pump has an inlet higher in level than an outlet of the upstream pump and higher in level than an outlet of the filter. That is, the downstream pump is disposed higher in level than the upstream pump and the filter. Accordingly, this allows a processing liquid to flow upward. Even when air bubbles are generated in the processing liquid, buoyancy causes the air bubbles to move upward in the processing liquid flow path and collect the air bubbles on a downstream side. Consequently, the air bubbles are readily vented from the processing liquid flow path.

An aligner includes a plurality of substrate rotators and a shaft member. Each substrate rotator includes a holder, a notch detector, an electromagnetic clutch and a driving belt. Each holder sucks the back surface of the substrate under vacuum and horizontally holds the substrate. Each notch detector detects a notch formed at the substrate, and supplies a detection result to the corresponding electromagnetic clutch as a detection signal. One end of the shaft member is connected to a motor. The shaft member is continuously rotated by the motor. Each electromagnetic clutch switches to a connection state in which rotational force of an inner periphery is transmitted to an outer periphery and a disconnection state in which rotational force of the inner periphery is transmitted to the outer periphery according to a detection signal supplied from the notch detector.

Alignment device and substrate processing apparatus

A substrate is transported based on coordinates information indicating a receiving position of the substrate and a placement position of the substrate by a hand. If the substrate is shifted from a first position, the substrate is received by the hand while a center of the substrate is shifted from a normal position of the hand. The hand that holds the substrate is moved toward a second position. A plurality of portions at an outer periphery of the substrate are detected before the substrate is placed. A shift of the substrate with respect to the normal position of the hand is detected based on the detection result, and the coordinates information is corrected such that a shift between a position of the center of the substrate to be placed at the second position by the hand and the center of the second position is canceled.

Substrate processing apparatus and substrate processing method

A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a rinse liquid is supplied to a peripheral edge of the substrate so that a processing liquid on the peripheral edge of the substrate is removed. An edge cut width between a position of an outer peripheral portion of the substrate rotated by the spin chuck in an edge exposure unit and a position of an outer peripheral portion of a film on the substrate is detected. Based on the detected edge cut width, a positional deviation of the center of the substrate held in the spin chuck from a rotation center of the spin chuck in the coating processing unit is determined while a supply state of the rinse liquid by an edge rinse nozzle is determined.

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Kyoto, Japan

Masahito Kashiyama