Kaneka Corporation

Nichia Corporation

Masahito Ide

Takao Manabe

Hirofumi Inari

Aki Kitajima

Masafumi Kuramoto

Tomohide Miki

Katsuya Ouchi

Manabu Tsumura

Komei Tahara

Makoto Seino

Susumu Amano

Yoshikatsu Ichiryu

Ikuya Nii

A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Photosensitive composition, colored pattern and method for producing same

The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Positive photosensitive composition, thin film transistor, and compound

An object of the present invention is to provide a polysiloxane compound that can be developed in an aqueous alkali solution and can yield a cured product or thin film having superior heat-resistant transparency and insulating properties, a curable composition thereof, and a thin film transistor provided with a passivation layer or gate insulator using the same, and the present invention relates to a polysiloxane compound having at least one photopolymerizable functional group in a molecule thereof, and having at least one member selected from the group consisting of an isocyanuric acid backbone structure, a phenolic hydroxyl group and a carboxyl group within the same molecule, to a curable composition containing the polysiloxane compound, and to a cured product thereof.

Alkali-developable curable composition, insulating thin film using the same, and thin film transistor

It is an object of the present invention to provide: a curable composition that has photocurability and provides a cured product excellent in insulating properties; and the cured product. This can be achieved by a photocurable composition that contains, as essential components, (A) a modified polyorganosiloxane compound having a photopolymerizable functional group and an SiH group, (B) a compound having a carbon-carbon double bond, and (C) a photopolymerization initiator. A thin film produced from the curable composition of the present invention has excellent insulating properties. Since the curable composition of the present invention can form a film by solution coating, it is applicable to provide thin-film insulating materials that can be formed by solution coating.

Photocurable composition and cured product

A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.

Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device

The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

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Settsu, Japan

Masahito Ide