Taiyo Ink Manufacturing Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Masahisa Kakinuma

Minoru Yokoshima

Tetsuo Ohkubo

Masatoshi Kusama

Nobuyuki Suzuki

Shigeru Ushiki

Osamu Kawana

Hideaki Kojima

Kouichi Takagi

Tsuyoshi Mitani

Shigeru Komori

Kazunori Sasahara

Katsuto Murata

Ooki Tomobe

Nobuyuki Yanagida

Kazuhiro Yoshida

A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa&#xb7;s at 25&#xb0; C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof

Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing photosensitive polymer obtained by the reaction of a copolymer of (a) a compound containing an unsaturated double bond and a carboxyl group and (b) an unsaturated double bond-containing compound with (c) a compound containing an unsaturated double bond and an epoxy group, (B) a diluent, (C) a photopolymerization initiator, (D) an inorganic powder, and (E) a stabilizer. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate. A calcined pattern of high fineness is obtained by patterning the superposed layer of the composition by selective exposure to light and development, and thereafter calcining the patterned film.

Photosensitive composition and calcined pattern obtained by use thereof

Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing polymer obtained by the reaction of (a) a hydroxyl group-containing polymer with (b) a polybasic acid anhydride and/or (F) a carboxyl group-containing photosensitive polymer obtained by causing the carboxyl group-containing polymer (A) mentioned above to react further with a compound containing a glycidyl group and an unsaturated double bond, (B) a diluent, (C) a photopolymerization initiator, and (D) an inorganic powder. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate. A calcined pattern of high fineness is obtained by patterning the superposed layer of the composition by selective exposure to light and development, and thereafter calcining the patterned film.

Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing photosensitive polymer obtained by the reaction of a copolymer of (a) an unsaturated double bond-containing acid anhydride and (b) an unsaturated double bond-containing compound with (c) a compound containing a hydroxyl group and an unsaturated double bond, (B) a diluent, (C) a photopolymerization initiator, (D) an inorganic powder, and (E) a stabilizer. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate. A calcined pattern of high fineness is obtained by patterning the superposed layer of the composition by selective exposure to light and development, and thereafter calcining the patterned film.

A composition for the formation of barrier ribs of a plasma display panel and a method for the formation of the barrier ribs are disclosed. The formation of barrier ribs is effected by applying either a composition comprising (A) a low-melting glass having a working point of not more than 560.degree. C. , (B) a hydroxyl group-containing polymer having at least two hydroxyl groups per molecule, (C) an inorganic filler, (D) a diluent, and (E) an organosilicic compound possessing in one terminal part thereof an alkoxysilane group having at least two alkoxy groups bonded thereto and in the other terminal part thereof an amine terminal group or a composition comprising (F) a blocked isocyanate compound having isocyanate groups blocked with an amine in addition to the components (A) through (E) mentioned above to a photosensitive film on a substrate so as to fill up grooves formed in the photosensitive film in a prescribed pattern, drying the composition, thermally curing the composition, separating the photosensitive film from the substrate by means of a remover, and subsequently calcining the hardened composition.

Compositions and method for formation of barrier ribs of plasma display

The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.

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Osato-gun, Japan

Masahisa Kakinuma