Shin-Etsu Chemical Co., Ltd.

Masahiro Yuyama

Hitoshi Arai

Ichiro Kaneko

Mikio Aramata

Tomohiro Inoue

Manabu Furudate

Yoshitsugu Eguchi

Kiyoshi Motomi

Atushi Sugitani

Tetsuya Inukai

Kazutoshi Fujioka

Ryuichi Saito

Hajime Ishizaka

Tatsuya Fujimoto

Provided are a photocatalyst transfer film allowing a uniform and highly transparent photocatalyst layer to be transferred to the surfaces of various transfer base materials; and a production method thereof. The photocatalyst transfer film has, on a biaxially oriented polypropylene film, a photocatalyst layer containing a titanium oxide particle-containing photocatalyst, a silicon compound and a surfactant. The production method of the photocatalyst transfer film includes applying a photocatalyst coating liquid to a biaxially oriented polypropylene film; and performing drying. The photocatalyst coating liquid contains a titanium oxide particle-containing photocatalyst, a silicon compound, a surfactant and an aqueous dispersion medium.

Photocatalyst transfer film and production method thereof

Provided are a photocatalyst transfer film allowing a photocatalyst layer that is uniform, highly transparent, and exhibits an antimicrobial property in dark places to be transferred to the surfaces of various transfer base materials; and a production method thereof. The photocatalyst transfer film has, on a base film, a photocatalyst layer containing a titanium oxide particle-containing photocatalyst, antimicrobial metal-containing alloy particles, a silicon compound and a surfactant. The production method of the photocatalyst transfer film includes applying a photocatalyst coating liquid to a base film; and performing drying. The photocatalyst coating liquid contains a titanium oxide particle-containing photocatalyst, antimicrobial metal-containing alloy particles, a silicon compound, a surfactant and an aqueous dispersion medium.

The subject matter of the invention is a base sheet for the preparation of a flexible printed circuit board which is a three-layered laminate consisting of (a) an electrically insulating film of a plastic resin such as a polyimide, (b) an epoxy resin-based adhesive layer and (c) a copper foil bonded to the film (a) with intervention of the adhesive layer (b). The base sheet can exhibit excellent performance in respect of peeling resistance, soldering heat resistance, dimensional stability and solvent resistance as well as workability into a printed circuit board only when each of the layers (a), (b) and (c) has a specified thickness in a narrow range of 10-30 &mgr;m, 5-15 &mgr;m and 5-15 &mgr;m, respectively.

Base sheet for flexible printed circuit board

Organohalosilanes are prepared by reacting metallic silicon with a halogenated hydrocarbon in the presence of a copper or copper compound catalyst and an activated aluminum, aluminum alloy or aluminum carbide promotor. The reaction is carried out at a temperature of 250-400&deg; C. in a stirred tank reactor or a fluidized bed reactor. The inventive process shortens the time required for activation in the Rochow reaction and increases the selectivity for desirable diorganodihalosilanes. The steady state is thus prolonged and conversion of the silicon enhanced, resulting in an improved reaction performance.

Process for preparing organohalosilanes

When oganohalosilanes are prepared by charging a reactor with a contact mass containing metallic silicon and a copper catalyst and introducing an organohalide-containing gas into the reactor to effect the direct reaction, 50-10,000 ppm of bronze phosphide is added to the contact mass. The invention is successful in efficiently producing organohalosilanes in a high STY and low T/D.

Preparation of organohalosilanes

Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

Adhesive of epoxy resin, nitrile rubbers and curing agent

Polyimides comprising recurring units of the following general formula (1) ##STR1## wherein Ar.sub.1 represents a tetravalent aromatic group and each Ar.sub.2 represents a divalent aromatic group. Polyimide copolymers and preparations of the polyimides and the polyimide copolymers are also described.

Polyimides and processes for preparing the same

Polyimides comprising recurring units of the following general formula (1) ##STR1## wherein R.sub.1 represents a tetravalent aromatic group. Polyimide copolymers and preparations of the polyimides and the polyimide copolymers are also described.

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Kamisu, Japan

Masahiro Yuyama