Matsushita Electric Industrial Co., Ltd.

Masahiro Yoshimoto

Hiromitsu Taki

Kuniaki Kiyosue

Takehiko Yoneda

Yoshihiko Takayama

Nobuaki Nagai

Tokuji Nishino

Shinichirou Kaneko

Tetsjhi Tsujhi

An electronic component of the invention has: a substrate; first to third terminal portions disposed on the substrate; and at least one spiral conductor portion disposed between the first and second terminal portions. The third terminal portion is not electrically connected to other portions of the substrate, and the first and second terminal portions are electrically connected to or disconnected from each other. In the electronic component, the number of production steps is smaller, the cost is lower, and a more highly accurate inductor component is realized as compared with a laminated electronic component in which emphasis is put on increase of the capacitor component. It is possible to realize an electronic component having accurate band- or low-pass filter characteristics.

Electronic component

A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Face-mounting type module substrate attached to base substrate face to

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Miyazaki, Japan

Masahiro Yoshimoto