Tokyo Electron Limited

Masahiro Yoshida

Issei Ueda

Osamu Kuroda

Kouji Takuma

Yasuhiro Chouno

Satoshi Morita

Hiromitsu Nanba

Junya Minamida

Kazuyoshi Eshima

Keigo Satake

Akira Murata

Chikara Nobukuni

Kouji Kimoto

Tomiyasu Maezono

Hiroshi Nagayasu

Sadamichi Mori

Yuji Murakami

Shinji Sugahara

A plasma processing apparatus includes a storage; processors; a liquid supply which supplies, into the storage, at least a first liquid composed of a processing liquid or source liquids for composing the processing liquid; a detector which detects a value of a parameter indicating a state of the first liquid supplied into the storage or a state of the processing liquid in the storage; and a controller which controls the processors to perform a liquid processing in sequence. The controller determines, based on a detection result of the value of the parameter, whether it is possible to supply the processing liquid continuously into a preset number of processors concurrently under a condition requested by the processors, and, if not, the controller performs a simultaneous processing restricting control of reducing a number of processors which are supposed to perform the liquid processing concurrently to be lower than the preset number.

Substrate processing apparatus and operation method of substrate processing apparatus

A substrate transfer apparatus includes a substrate transfer device which loads and unloads multiple substrates into and from a cassette capable of accommodating the multiple substrates, a substrate detector device which detects the positions of the substrates in the cassette, and a control device which controls the transfer device. The control device includes a computation component which calculates a shifted amount between a base position and the position of each substrate such that the shifted amount from the base position is set as a positive value, a verification component which verifies whether the difference between the maximum and minimum values among the shifted amounts is equal to or less a threshold value, and a transfer control component which controls the transfer device such that the transfer device unloads the substrates from the cassette when the verification component verifies that the difference is equal to or less than the threshold value.

Apparatus for transferring substrate, substrate processing system, method for transferring substrate and memory medium

Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Substrate processing apparatus

A substrate processing apparatus includes a substrate transit table configured to mount thereon a plurality of substrates; a substrate processing chamber configured to process the substrate one by one; a substrate transfer device capable of loading the substrate into the substrate processing chamber from the substrate transit table and unloading the substrate from the substrate processing chamber to the substrate transit table; and N number of (N is an integer equal to or larger than 3) substrate holding devices provided at the substrate transfer device and configured to hold the substrates one by one. Here, a multiplicity of (2 to N&#x2212;1 number of) substrates are concurrently held by 2 to N&#x2212;1 number of substrate holding devices among the N number of substrate holding devices and one substrate is loaded into the substrate processing chamber.

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

Disclosed are a substrate processing apparatus, a substrate processing method, and a storage medium, which can process a normal substrate according to a normal schedule in parallel with a substrate to be processed in preference to other substrates. Processing block performs the same types of processes for substrates, carried therein from FOUP placing unit, by using process arms. When a priority substrate having a priority over other substrates are carried, control unit carries and processes the priority substrate in priority processing unit that can receive a next substrate among priority processing units to which a plurality of processing units are partially or wholly assigned, in preference to other substrates.

Substrate processing apparatus, substrate processing method, and storage medium

A liquid processing apparatus is arranged to planarize a film on a substrate by supplying onto the film a process liquid for dissolving the film while rotating the substrate. The apparatus includes a substrate holding member configured to rotatably hold the substrate in a horizontal state, a rotation mechanism configured to rotate the substrate holding member, and a liquid supply mechanism configured to supply the process liquid onto a surface of the substrate. The liquid supply mechanism includes first and second liquid delivery nozzles configured to deliver the same process liquid. The first liquid delivery nozzle has a smaller diameter and provides a smaller delivery flow rate, as compared to the second liquid delivery nozzle. The first liquid delivery nozzle is inclined to deliver the process liquid in a rotational direction of the substrate, and is movable between a center of the substrate and a peripheral edge thereof.

Liquid processing apparatus and liquid processing method

The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N&#x2212;n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N&#x2212;n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N&#x2212;n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N&#x2212;n is not less than 2.

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Koshi, Japan

Masahiro Yoshida