Tatsuta Electric Wire & Cable Co., Ltd.

Masahiro Watanabe

Hiroshi Tajima

Kenji Kamino

Sirou Yamauchi

Kouji Takami

Shigeki Takeshita

Yoshihiro Hosoya

Yuusuke Haruna

Sougo Ishioka

Yukari Kobayashi

Kiyoharu Sekiguchi

An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer. Conductive bumps are formed on a side of the adhesive layer of the shield layer. The conductive bumps are positioned on a tessellation of one kind of polygon at vertices of respective polygons, and the conductive bumps are arranged such that, with respect to each of the conductive bumps, when drawing line segments connecting respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one line segment among the drawn line segments, the straight line has a portion that does not overlap with the other line segments.

Electromagnetic wave shield film

An affixation filmfor a printed wiring board includes a circuit pattern concealing layer, and an adhesive layerput on top of the circuit pattern concealing layer. An opposite surface of the circuit pattern concealing layerfrom the adhesive layerhas an Rku of 2.5-3.0.

Affixation film for printed wiring board

An adhesive film for a printed wiring board includes an adhesive layerand an insulating protective layer. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

Adhesive film for printed wiring board

Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 &#x3bc;m, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.

Electromagnetic wave shielding film

An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/mper 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil

An electromagnetic wave shielding film includes an insulating protective layer, and a release film covering a surface of the insulating protective layer. The release film has a transmittance of 20-80% at a wavelength of 535 nm, a tight attachment confirmability index Ia of 11 or more, the tight attachment confirmability index Ia being represented by expression 1, and a presence visibility index Iv of 11 or more, the presence visibility index Iv being represented by expression 2.=(&#x394;)&#x2003;&#x2003;(expression 1)=(&#x394;)&#x2003;&#x2003;(expression 2)

A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layerwhich is 0.5 &#x3bc;m to 12 &#x3bc;m thick and an anisotropic conductive adhesive layerwhich is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.

Shield film, shielded printed wiring board, and method for manufacturing shield film

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 &#x3bc;m thick.

Reinforcing member for flexible printed wiring board flexible printed wiring board, and shield printed wiring board

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 &#x3bc;m thick.

Growing community of inventors

Kizugawa, Japan

Masahiro Watanabe