Hitachi, Ltd.

Masahiro Wanami

Mamoru Kobayashi

Hideyuki Fukasawa

Yosuke Inoue

Michiyoshi Maki

Akira Kabashima

Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.

Method and apparatus for aligning solder balls

Cleaning system to clean articles to remove foreign matters from surfaces of the articles. At least two treatment baths filled with respective cleaning liquids are provided. An intermediate bath is located between the adjacent two treatment baths. The intermediate bath is filled with the cleaning liquid filled in one of a pair of the adjacent treatment baths adjacent to the intermediate bath, and the cleaning liquid filled in the intermediate bath is then replaced with the cleaning liquid filled in the other treatment bath. At least one of the articles is moved successively from a first to the last one of the at least two treatment baths and through at least one the intermediate bath, while the article is maintained continuously and completely immersed in the cleaning liquid.

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Hadano, Japan

Masahiro Wanami