Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Masahiro Taniguchi

Satoshi Furuichi

Kazumi Ishimoto

Masahiro Kihara

Toshinori Mimura

Masanori Ikeda

Kurayasu Hamasaki

Toshihiko Nagaya

Kimihito Kuwabara

Michinori Tomomatsu

Hiroaki Onishi

Youichi Nakamura

Kenichi Nakano

Nobuya Matsumura

Manabu Ando

Osamu Yamazaki

Koichi Nagai

Kazue Okanoue

Osamu Matsushima

Kazuhiro Uji

Tatsuaki Kitagawa

Seizo Nemoto

Yousuke Hassaku

Yoshinori Isobata

Kazuo Kido

Masaru Nonomura

Masafumi Inoue

Hiroshi Okamura

Tomotaka Nishimoto

Hiroyuki Kondo

Yoichi Nakamura

A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

Component mounting using feedback correction

A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.

Mounting board manufacturing system and mounting board manufacturing method

A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.

Component mounting system

There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.

In a component mounting system having an inspection device performing a mounting inspection after component mounting, a correction value for correcting a mounting program is calculated based on board inspection information including fed-back component position deviation information, a component is mounted on a board in accordance with the mounting program corrected based on the calculated correction value, and a 'present value' based on most recent board inspection information and a 'pre-correction evaluation value' are displayed together on an evaluation value display screen as evaluation values representing accuracy at a time of the mounting based on the board inspection information during this component mounting work, the &#x201c;pre-correction evaluation value&#x201d; being calculated based on a temporary position deviation amount pertaining to a case where it is assumed that no correction based on the calculated correction value has been performed.

Component mounting system and component mounting method

To measure a film thickness of a coating film () of a flux () serving as a bonding paste formed on a transfer stage () of a paste transfer unit (), the film thickness of the coating film () in a transfer area () is measured through a light-transmitting member () by a light interference method and by an optical type film thickness measuring sensor () which is arranged below the transfer stage (). Thus, it is possible to automatically and accurately measure the film thickness of the flux () in the transfer area () without requiring any complicated measurement work.

Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method

A mounting-line power control device () includes: a target value obtaining unit () which obtains, for each mounting line, a target value for demand power for a first period; a priority obtaining unit () which obtains a first priority level of each mounting line; a target value changing unit () which decreases the target value for the demand power of a second mounting line in the first period when the demand power of a first mounting line in the first period exceeds its target value, the second mounting line having the lower first priority level than the first mounting line; and a power usage changing unit () which reduces power used in the first period by the component-mounted board production apparatus included in the second mounting line, such that the demand power of the second mounting line in the first period does not exceed the decreased target value.

Mounting-line power control device and mounting-line power control method

A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

Component mounting method and component mounter

A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.

Method of determining solder paste height and device for determining solder paste height

A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.

Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method

For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

Reflow method and reflow device

An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Apparatus for printing solder paste to a printed circuit board and

The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Reflow apparatus and method

A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Growing community of inventors

Yamanashi, Japan

Masahiro Taniguchi