Kabushiki Kaisha Toshiba

Other

Kuroda Denki Kabushiki Kaisha

Masahiro Tadauchi

Izuru Komatsu

Kouichi Teshima

Takeshi Gotanda

Kazuo Suzuki

Mitsuhiro Tomita

Yukishige Maezawa

Hideki Shimada

Yoshiyuki Goto

Tomiaki Furuya

Kazutaka Matsumoto

Tetsuji Hori

Hiroshi Tateishi

Terunobu Hayata

Fuminobu Tezuka

Jiro Kano

Isao Ito

Makoto Gonda

Takayuki Suzuki

Masao Koyama

Cao Minh Thai

Koichi Teshima

Jun Sugimoto

Mitsuyoshi Hirayama

Satoshi Kanazawa

The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

Thermosetting flux and solder paste

A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Mounting material, semiconductor device and method of manufacturing semiconductor device

Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

Solder material, device using the same and manufacturing process thereof

Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

Soldering method and soldering apparatus

Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.

Solder material and method of manufacturing solder material

Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG.,which satisfies the formulas: 1&lE;x&lE;20, 3&lE;y&lE;13 and 3&lE;(x&plus;y)/2&lE;13, or formulas: 0.1&lE;x&lE;25, 2&lE;y&lE;15 and 2&lE;(x&plus;y)/2&lE;15.

Method of joining metallic members, and joined metallic members

Disclosed is a method and apparatus for pyrolytically decomposing waste plastic which may contain halogen-containing polymer such as PVC. The plastic is heated at 270&deg; to 350&deg; C., whereby a plasticizer contained in the plastic material is decomposed and vaporized, and a chlorine-containing polymer is dechlorinated to produce hydrogen chloride. The vaporized decomposition matter and the hydrogen chloride are removed from the plastic, and the vaporized decomposition matter is separated from the hydrogen chloride. Then isolated plastic is further heated to 450&deg; C. or higher to produce a pyrolysis product. Alternatively, the former heating step is divided into two steps of: heating at a temperature lower than 270&deg; C., whereby a plasticizer is decomposed; and heating to 270&deg; to 350&deg; C., whereby a chlorine-containing polymer contained in the plastic material is dechlorinated. Accordingly, the decomposition matter of plasticizer and hydrogen chloride are separately removed from the plastic.

Method and apparatus for pyrolytically decomposing waste plastic

Disclosed is a method and an apparatus for pyrolytically decomposing waste plastic, e.g. PVC, to recover light fuel oil. The invention enables to prevent the product from contamination by halogen compounds. The plastic is first thermally decomposed in an atmosphere of a normal or reduced pressure to produce a primary decomposition product in the form of gas and a decomposition residue. The primary decomposition product is cooled at a first cooling temperature to separate the primary decomposition product into a relatively light fraction containing a desired light constituent and a relatively heavy fraction by condensation of the relatively heavy fraction, and the relatively heavy fraction is then thermally decomposed in an atmosphere pressurized at a predetermined pressure to produce a secondary decomposition product containing the desired light constituent in the form of gas. The relatively light fraction and the secondary decomposition product are cooled at a second cooling temperature to condense a fraction containing the desired light constituent. This method may be changed so that the first and second thermal decomposition steps are performed at the same high pressure in one vessel and the heavy fraction is circulated. Additionally, alkali treatment of time plastic to be decomposed or the decomposition gas, thermal pretreatment of the plastic and addition of water or catalyst to the plastic can be used. The decomposition apparatus which is so systematized that the decomposition can be continuously performed is shown.

Growing community of inventors

Tokyo, Japan

Masahiro Tadauchi