Hitachi, Ltd.

Hitachi Maxell, Limited

Hitachi Chemical Company, Ltd.

Masahiro Suzuki

Akio Takahashi

Akira Nagai

Shin Nishimura

Junichi Katagiri

Haruo Akahoshi

Akio Mukoh

Masao Suzuki

Ryuji Watanabe

Tsutomu Imai

Osamu Miura

Ken Yoshizawa

Takao Miwa

Takeyuki Itabashi

Satoru Amou

Hitoshi Suzuki

Akira Gotoh

Seiichi Matsushima

Yukio Ookoshi

Yoshinori Kawai

Yuichi Satsu

Toshikazu Narahara

Motoyo Wajima

Koji Suzuki

Akira Kageyama

Toshinori Sugiyama

Katuo Sugawara

Shigeo Amagi

Haruhiko Matsuyama

Yoshihiro Nomura

Akira Saito

Yoshiaki Okabe

Yoshitane Tsuburaya

Toshiyasu Kawai

Yoshihiro Suzuki

Takeo Sonobe

Yoshitane Tuburaya

Masatoshi Hashimoto

Hiroyuki Hirata

Kiyonori Kogawa

Mitsuru Shimizu

Shinji Iioka

Toshinari Takada

Yoichi Daiko

Haruo Arai

Tosio Higasihara

Koreaki Kurane

Masahide Yagi

Yasuyuki Mori

Yoshihiko Honda

Toshio Higasihara

Toshio Higashihara

To implement the alignment of lenses with a simple configuration or by a simple method. A lens unit includes a plurality of lenses each including a lens portion and a flange portion surrounding the lens portion, and a tube portion that holds the plurality of lenses successively arranged along an optical axis. The holder body includes first and second receive portions successively formed along the optical axis. The first receive portion holds the lenses by pressing the side of the flange portion that extends along the optical axis. The second receive portion receives the lens such that the lens can be moved in a direction crossing the optical axis.

Lens unit, camera module and manufacturing method of lens unit

A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6&prime;-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4&prime;-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

Adhesive film of quinoline polymer and bismaleimide

A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer

A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5&deg; or less, can provide a high wiring density and signal transmission performance.

Thin-film multilayer wiring board and production thereof

A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.

Multilayer wiring substrate and method for production thereof

A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

Thin film wiring board

A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

LSI package board

A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group. The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

Polymerizable compouund, process for producing same and setting

A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group. The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

Polymerizable compound, process for producing same and setting

A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

Multilayer printed circuit board and production thereof

An optical recording disc which includes a pair of recording disc substrates opposed to each other with a space there between with a hub situated at the central portion of the disc substrates so that there is formed the closed space between the disc substrates, thereby providing a dual sided recordable optical recording disc. The hub may be formed by a pair of hub halves. There is disposed an annular inner spacer and annular outer space around the hub so as to separate the pair of recording disc substrates.

Optical disc manufacturing method

Disclosed is an optical data recording medium provided with a glass substrate and a recording layer carried by the glass substrate, wherein the glass substrate is composed of a glass plate having a mixed layer of metallic tin or a tin compound formed on at least one surface thereof, a content of the metallic tin or tin compound on the surface of the glass substrate being regulated to 1.3 wt % or less and the entire surface of the glass plate being subject to a chemically reinforcing treatment, and also disclosed is a method of manufacturing an optical data recording medium provided with a glass substrate and a recording layer carried by the glass substrate, which comprises the steps of making a glass plate by a float method using melted metallic tin for the glass substrate, cutting the glass plate to a desired configuration and size, polishing at least one surface of the glass plate which is in contact with the melted metallic tin when making the glass plate to regulate a content of tin in the polished surface to 1.3 wt % or less, and subjecting the polished glass plate to a chemically reinforcing treatment.

Optical data recording medium and method of manufacturing the same

An optical information recording disc having at least one substrate for recording/reproducing information through an optical unit wherein a spindle hole, through which a spindle is provided as a disc drive system, is formed in a central portion of the substrate and an engagement member engageable with a disc engagement member integrally formed with the spindle, is formed around the central portion.

Optical information recording disc and apparatus for driving the disc

The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

Multi-layer circuit board, method of manufacturing the same and

A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):

Thermosetting resin composition, printed circuit board using the resin

Growing community of inventors

Iwaki, Japan

Masahiro Suzuki