Shinko Electric Industries Co., Ltd.

Taiyo Yuden Co., Ltd.

Renesas Technology Corp.

Kabushiki Kaisha Toshiba

Sharp Kabushiki Kaisha Corporation

Mitsubishi Denki Kabushiki Kaisha

Shinko Electric Industries Inc., Ltd.

Masahiro Sunohara

Mitsutoshi Higashi

Kei Murayama

Akinori Shiraishi

Yuichi Taguchi

Hideaki Sakaguchi

Naoyuki Koizumi

Toshinori Koyama

Kazutaka Kobayashi

Naohiro Mashino

Hiroyuki Kato

Takaharu Yamano

Yoshihiko Nemoto

Akihito Takano

Keisuke Ueda

Syoji Watanabe

Kenji Takahashi

Tomoharu Fujii

Kenichi Ota

Yuichi Sasajima

Yoshihiro Machida

Kiyoshi Oi

Shigeaki Suganuma

Yukiharu Takeuchi

Hajime Iizuka

Manabu Nakamura

Tetsuya Koyama

Hiroshi Shimizu

Yuichiro Shimizu

Tomotoshi Sato

Toshio Gomyo

Tatsuya Nakamura

Tomonori Fujii

Kiyoshi Ol

Ken Sato

Takako Yoshihara

Riku Nishikawa

Takayuki Tokunaga

Hedeaki Sakaguchi

Mitsutoshi Higashii

A substrate fixing device includes a base plate, a ceramic plate fixed to the base plate and configured to adsorb a substrate by electrostatic force, and an adhesive layer bonding the base plate and the ceramic plate. The adhesive layer includes a plurality of linear heat transfer bodies arranged adjacent to each other such that a longitudinal direction of each linear heat transfer body is along a stack direction of the ceramic plate and the base plate, and a resin filled between adjacent heat transfer bodies of the heat transfer bodies and bonded to the ceramic plate and the base plate.

Substrate fixing device

An electrostatic chuck includes a ceramic plate, an adsorption electrode, a ground electrode, and a wiring. The adsorption electrode is built-in near one surface of the ceramic plate. The ground electrode is arranged in the ceramic plate between the other surface of the ceramic plate and the adsorption electrode, and can be connected to a ground potential. The wiring is connected to the ground electrode in the ceramic plate and extends to the one surface of the ceramic plate.

Electrostatic chuck and substrate fixing device

A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and including a first metal layer formed on a part of an inner side surface of the through hole at the one surface side, a first wiring layer that covers the first metal layer to fill a part of the through hole at the one surface side, a second metal layer continuously formed on the rest part of the inner side surface of the through hole at the other surface side and on an end portion of the first wiring layer at the other surface side, and a second wiring layer that covers the second metal layer to fill a part of the through hole at the other surface side.

Wiring board with through wiring

A wiring substrate includes a substrate body, a through hole extending through the substrate body from an upper surface to a lower surface of the substrate body, and a through electrode formed in the through hole. The through electrode includes a conductive layer that forms a cavity in the through hole, and a resin layer that fills the cavity. The conductive layer includes first to third metal layers. The first metal layer is formed on an upper wall surface of the through hole. The second metal layer covers at least a portion of the first metal layer and an upper opening of the through hole. The third metal layer is formed on a lower wall surface of the through hole and connected to at least the first metal layer or the second metal layer.

Wiring substrate

A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the wiring insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked without the adhesive layer interposed between the electrode layer and the wiring layer.

A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.

Wiring board, semiconductor device, and method for manufacturing wiring board

A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.

A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer.

Wiring substrate and manufacturing method thereof

A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.

Package for electronic component, manufacturing method thereof and sensing apparatus

A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.

Substrate and method for manufacturing the same

A wiring substrate includes a substrate body including a first substrate surface and a second substrate surface, a trench being open toward the first substrate surface, the trench having an inner bottom surface and an inner side surface, a through-hole having a first end communicating with the inner bottom surface of the trench and a second end being open toward the second substrate surface, a first conductive layer having a first surface toward the trench and being filled inside at least a portion of the through-hole from the second end, a second conductive layer covering the first surface and at least a part of the inner bottom surface of the trench, and a third conductive layer covering the second conductive layer and being filled inside the trench.

Wiring substrate and method for manufacturing the wiring substrate

A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other.

Capacitor-embedded substrate and method of manufacturing the same

An interposer mounted wiring board includes a wiring board including outermost wiring layers respectively on both surfaces thereof, the outermost wiring layers being electrically connected to each other through an inside of the board, and first and second interposers electrically connected to the outermost wiring layers on the both surfaces of the board, respectively. Each of the first and second interposers has a value of a coefficient of thermal expansion (CTE), the value being equal or close to a value of a CTE of a corresponding one of first and second electronic components to be mounted respectively on the first and second interposers. The base member of each of the interposers is preferably formed of silicon, and the base member of the wiring board is preferably formed of resin. Further, the electronic components are mounted respectively on surfaces of the interposers and thus form a semiconductor device, the surfaces being opposite to the surfaces of the interposers facing the wiring board.

Interposer mounted wiring board and electronic component device

A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.

Heat radiation package and semiconductor device

A wiring substrate includes a wiring layer, an insulating layer formed on the wiring layer, a connection pad formed on the insulating layer, and a via conductor formed to penetrate the insulating layer, and connecting the wiring layer and the connection pad, wherein the wiring layer located under the connection pad is formed to have via receiving electrode portion whose area is smaller than an area of the connection pad, and a wiring portion separated from the via receiving electrode portion, in an area corresponding to the connection pad, and the via receiving electrode portion is connected to the connection pad via the via conductor.

Wiring substrate and semiconductor device

Growing community of inventors

Nagano, Japan

Masahiro Sunohara