Osaka Gas Company Limited

Kyoto University

Masahiro Suemitsu

Tadashi Saito

Masayuki Sugimoto

Susumu Noda

Takashi Asano

Menaka De Zoysa

Provided is a radiative cooling device that is flexible, has increased weather resistance, and can be produced at a low cost. The radiative cooling device includes: an infrared radiative layer A having a radiative surface H for radiating infrared light IR; and a light reflective layer B on a side of the infrared radiative layer A, which is opposite to the radiative surface H. The infrared radiative layer A is a resin material layer J having a thickness adjusted so that the resin material layer emits heat radiation energy greater than absorbed solar energy in a wavelength range from 8 μm to 14 μm. The resin material layer J includes a vinyl chloride-based resin as a resin material in which a plasticizer is mixed. The plasticizer is any of phthalic acid esters, aliphatic dibasic acid esters, and phosphoric acid esters.

Radiative cooling device

Provided is a radiative cooling device that appears white as viewed from a radiative surface side and has increased durability. The radiative cooling device includes an infrared radiative layer A having a radiative surface H for radiating infrared light, a light reflective layer B on a side of the infrared radiative layer A, which is opposite to the radiative surface H, and a protective layer D between the infrared radiative layer A and the light reflective layer B. The infrared radiative layer A is a resin material layer J having a thickness adjusted so that the resin material layer J emits heat radiation energy greater than absorbed solar energy in a wavelength range from 8 μm to 14 μm. The light reflective layer B includes silver or a silver alloy.

The radiative cooling device includes an infrared radiative layer A that radiates infrared light IR from a radiative surface H, a light reflective layer B disposed on a side opposite to the radiative surface H with respect to the infrared radiative layer A, and a protective layer D disposed between the infrared radiative layer A and the light reflective layer B. The infrared radiative layer A is a resin material layer J having a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm. The light reflective layer B contains silver or a silver alloy, and the protective layer D is formed from a polyolefin based resin with a thickness of 300 nm or more and 40 μm or less or an ethylene terephthalate resin with a thickness of 17 μm or more and 40 μm or less.

Radiative cooling device and radiative cooling method

The radiative cooling film material includes a film material; and a radiative cooling layer on an outer surface of the film material. The radiative cooling layer includes an infrared radiative layer having a radiative surface for radiating infrared light; and a light reflective layer on a side of the infrared radiative layer, which is opposite to the radiative surface. The infrared radiative layer is a resin material layer including a vinyl chloride resin or a vinylidene chloride resin and having a thickness adjusted so that the resin material layer emits heat radiation energy greater than absorbed solar energy in a wavelength range from 8 μm to 14 μm. The light reflective layer includes silver or a silver alloy, and the radiative cooling film material further includes a film material-side resin layer including a vinyl chloride resin or a vinylidene chloride resin as a rear surface portion of the film material.

Radiative cooling film material

A radiative cooling device in which an infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on a side opposite the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer includes a first layer made of silver or silver alloy, a second layer made of aluminum or aluminum alloy and an anti-alloying transparent layer for preventing alloying between silver and aluminum are stacked in the order of the first layer, the anti-alloying transparent layer and the second layer with the first layer closest to the infrared radiative layer.

A heat-radiating light source including a heat-radiating layer and a substrate laminated thereon for heating the heat-radiating layer is disclosed. A heat-radiating layer and a substrate for heating the heat-radiating layer are laminated. In the heat-radiating layer, there are provided a radiation control portion and a radiating transparent oxide layer, the radiation control portion having an MIM lamination portion including a pair of platinum layers juxtaposed along lamination direction and a resonating transparent oxide layer formed of a transparent oxide and disposed between the pair of platinum layers, the radiation control portion and the radiating transparent oxide layer are laminated with the radiation control portion and the radiating transparent oxide layer are disposed closer to the substrate in this order. The resonating transparent oxide layer R has a thickness providing a resonance wavelength equal to or smaller than 4 μm.

Heat-radiating light source

A radiative cooling device that is in a state in which a radiative surface is colored is provided. A radiative cooling device CP includes an infrared radiative layer A that radiates infrared light IR from a radiative surface H, a light reflective layer B that is disposed on the side opposite to the radiative surface H with respect to the infrared radiative layer A, and a color portion X. The infrared radiative layer A is a resin material layer J that has a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm, and the color portion X contains a colorant that absorbs light in the visible range.

Radiative cooling device and cooling method

A radiative cooling device having high flexibility that can be retrofitted to an existing outdoor facility. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided. The infrared radiative layer is a resin material layer whose thickness is adjusted to discharge a greater thermal radiation energy than absorbed solar light energy in a wavelength band ranging from 8 μm to 14 μm.

A radiative cooling device that can cool a cooling target appropriately with cost reduction of its light reflective layer. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer located on the opposite side of the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked manner. The light reflective layer is arranged such that a first layer made of silver or silver alloy and a second layer made of aluminum or aluminum alloy are stacked, with the first layer being disposed on the side close to the infrared radiative layer.

A radiative cooling device and a radiative cooling method that effectively suppress ultraviolet light absorption. The radiative cooling device includes an ultraviolet reflection layer that reflects ultraviolet light UV, a light reflection layer that reflects visible light and infrared light, and an infrared radiative layer that radiates infrared light IR. Infrared light IR is radiated form a radiative surface. The ultraviolet reflection layer, the infrared radiative layer and the light reflection layer are laminated in this order as viewed from the side of the radiative surface.

Provided is a radiative cooling device that provides coloration of the radiative surface while maximally avoiding reduction in its radiative cooling performance due to absorption of solar light. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer. The transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

A thermal emission source is provided that has a structure capable of suppressing deterioration of an optical assembly over time. The thermal emission source includes an optical assembly () having an optical structure in which a member made of a semiconductor has a refractive index distribution so as to resonate with light of a wavelength shorter than a wavelength that corresponds to an absorption edge corresponding to a band gap of the semiconductor. The optical assembly () includes a coating structure () with a coating material that differs from the semiconductor of refractive portions () and through which light of a wavelength included in a wavelength range from visible light to far infrared rays can be transmitted.

Growing community of inventors

Osaka, Japan

Masahiro Suemitsu