Matsushita Electric Industrial Co., Ltd.

Other

Masahiro Oita

Hyogo Hirohata

Koreaki Nakata

Katsuhiko Honjo

Nobumasa Oshima

Nobuhiro Hamasaki

Tsunehiko Todoroki

Naohumi Tonoka

An automatically depolarizing electrode system for analyzing ions and gases in a solution, especially in blood. A magnetic stirrer is placed in a test chamber of the electrode system and rubs the sensing surface of the electrode which constitutes the wall of the test chamber. During analysis, the rotating stirrer prevents blood from coagulating on the sensing portion of the electrode, so that the electrode is constantly kept clean and depolarized. Preferred is a flat and solid state ion selective electrode for this electrode system. Additionally, the size of the stirrer is designed not only to lessen the amount of a sample solution which is present in the test chamber but to prevent the reading response from retarding.

Dissolved gas and ion measuring electrode system

An electrode system for measuring oxygen gas in a solution comprises a pair of electrodes consisting of an indicator electrode and a reference electrode immersed in an electrolyte solution and a membrane pressed against the indicator electrode. On the other side of the membrane, is a solution to be analyzed. In determination of gas in solution especially in blood, good reproducibility of data, a stable reading and a long performance life are obtained by rubbing the surface of the indicator electrode and rotating a magnetic stirrer on the membrane. These effective measures prevent the electrode and the membrane from being contaminated. Accordingly, continuous analysis of arterial blood can be achieved.

Dissolved oxygen gas measuring electrode system

A chip type tantalum capacitor has an insulating resin frame, a pair of substantially flat metal foil terminals bonded to both sides of the frame, at least one of the frame sides having a slit therethrough and open to the outside of the metal foil terminal on the one frame side, the metal foil terminal on the one frame side being a metal selected from the group consisting of copper and nickel. A tantalum capacitor element having a pair of terminals is enclosed in the frame, at least one of the element terminals being a lead wire made of tantalum, the lead wire extending through the slit and outside the metal foil terminal on the one side of the frame and being bent at the outside surface of the metal foil terminal with the bent portion of the lead wire outside the metal foil terminal extending along the surface of the metal foil terminal and being welded to the metal foil terminal surface for being fixed thereto, the other element terminal being electrically connected to the other metal foil terminal. An insulating resin is potted in the space inside the frame and around the capacitor element.

Chip type tantalum capacitor

An anode comprising a porous sintered body made of tantalum powder each particle of which having a layer of at least one of V, Mo and Pd. This anode permits a solid electrolytic capacitor to have a low reverse current and a low leakage current. This invention also provides an effective method for preparing such anode.

Anode for solid electrolytic capacitor and method for making the same

An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.

Electroless copper plating solution

This invention provides a method for electroless copper plating comprising: providing an electroless copper plating bath composition which comprises 0.005 to 0.3 mole per liter of a water soluble copper compound, 0.005 to 0.6 mole per liter of a cupric complexing agent, 0.02 to 3.0 mole per liter of formaldehyde, 0.01 to 1000 milligram per liter of additive agent selected from the group consisting of 2,2'-dipyridyl, 2,9-dimethyl-1,10-phenanthroline and 2-(2-phridyl)-benzimidazole, and alkaline compound to hold the pH of said aqueous solution 10.5 to 14 and immersing a material having catalytic action at the surface into said electroless copper plating bath composition kept at a temperature of 70.degree. to 90.degree. C whereby copper film with a high mechanical strength is deposited on said material.

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Kashiwara, Japan

Masahiro Oita