Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Amdahl Corporation

Masahiro Ohta

Akihiro Yamaguchi

Shoji Tamai

Hideaki Oikawa

Saburo Kawashima

Norimasa Yamaya

Katsuaki Iiyama

Keizaburo Yamaguchi

Shoji Obuchi

Yasunori Yoshida

Yoshimitsu Tanabe

Tatsuhiro Urakami

Yoshiho Sonobe

Kouji Ohkoshi

Toshiyuki Nakakura

Nobuhito Koga

Atsushi Shibuya

Tadashi Kobayashi

Wataru Yamashita

Yoshihiro Sakata

Masumi Saruwatari

Midori Yamazaki

Masao Yoshikawa

Shuichi Morikawa

Akio Matsuyama

Eiji Senoue

Tomomi Yoshimura

Fumiaki Kuwano

Osamu Yasui

Keisuke Takuma

Toshiaki Takahashi

Satoru Kishi

Yoshihisa Gotoh

Hideo Sakai

Atsushi Morita

Tomohito Koba

Chiaki Maruko

Shinobu Moriya

Shoichi Tsuji

Misao Masuda

Masami Nakano

Hiroyasu Oochi

Katsunori Shimamura

Kayako Ito

Akinori Ryu

Masaki Amano

Kenichi Sugimoto

Masanobu Ajioka

Masakatsu Nakatsuka

Atsuo Otsuji

Masatoshi Takagi

Yuichi Okawa

Takashi Kuroki

Yoshiyuki Totani

Akio Karasawa

Hiroyuki Itoh

Toshihiko Tsutsumi

Michihiko Miyamoto

Katsuji Watanabe

Moritsugu Morita

Kazuo Miyazaki

Taizo Nagahiro

Kunio Nishihara

Rihoko Suzuki

Motokazu Hirao

Toshihiro Motoshima

Kan Ikeda

Yukiko Mori

Mineo Kobayashi

Tomonori Ito

Katsuaki Liyama

Fumiaki Ichikawa

Tatshuiro Urakami

Toshihiko Isutsumi

Kan Ideda

Yoshiho Snobe

Nubohito Koga

Ken-Ichi Goto

There is disclosed an organic optical component prepared from a resin essentially comprising one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## This invention provides an organic optical component with excellent transparency, heat resistance and mechanical strength as well as a low birefringence. This invention also provides a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.

Fluorine-containing polyamide

A low-birefringent organic optical component comprising a polymer prepared by polymerizing a racemic mixture of the monomer with an asymmetric spiro ring represented by general formula (1) as an essential ingredient; wherein ring A represents a monocyclic or polycyclic organic group, wherein two ring As are mutually bound each other via a spiro bond to form a spiro ring which has a molecular asymmetric structure; n is an integer of 0 to 10; X.sub.1 and Y.sub.1 are binding groups; and Z.sub.1 is a polymerization-active group. The component has excellent transparency, mechanical strength and heat resistance, as well as a low birefringence.

Low-birefringent organic optical component and a spirobiindan polymer

A low birefringent organic optical component prepared from a resin consisting essentially of one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## The organic optical component can exhibit excellent transparency, heat resistance and mechanical strength as well as a low birefringence. Also provided is a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.

Organic optical component

A sliding material and a heat resistant filament which primarily comprises a liquid crystal polyimide, a liquid crystal polyamide or a liquid crystal polyamide-imide copolymer having at least one recurring structural unit selected from the formula (1) and the formula (2) and is excellent in heat resistance, mechanical characteristics and other fundamental properties of polyimides, and relates to significant improvement of heat-resistance by heat-treating the sliding material, the filament and the molded items. The liquid crystal polyamide-imide copolymer which comprises in a polymer molecule 0.05.about.0.95 mole ratio of the recurring structural units of the formula (1) and 0.95.about.0.05 mole ratio of recurring structural units of the formula (2) has excellent processing ability ##STR1##

Liquid crystal polyamide-imide copolymer

A preparation process of polyhydroxycarboxylic acid comprising conducting dehydration polycondensation of hydroxycarboxylic acid or an oligomer of the same in a reaction mixture containing said hydroxycarboxylic acid or the oligomer of the same and an organic solvent substantially in the absence of water to give polyhydroxycarboxylic acid having an weight average molecular weight of 50,000 or more, successively mixing the reaction mixture containing said polyhydroxycarboxylic acid with at least one binder selected from the group consisting of (1) polyisocyanate compound, (2) polybasic acid anhydride, (3) cyclic imino ester, (4) cyclic imino ether, (5) aromatic hydroxycarboxylic acid, (6) polyamino compound, (7) polyhydric alcohol, (8) epoxy compound, (9) polyfunctional aziridine compound, (10) lactam, (11) lactone, and (12) diethylene glycol bischloroforate, and reacting to obtain polyhydroxycarboxylic acid having a weight average molecular weight of 100,000 or more the polyhydroxycarboxylic acid which is obtained by the process has a weight average molecular weight of 100,000 or more, has satisfactory mechanical strength in the form of molded articles and is useful as a degradable polymer for substituting medical materials and general purpose resins.

Preparation process of polyhydroxycarboxylic acid

Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.

Linear polyamic acid, linear polyimide and thermoset polyimide

Moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide to resin. A further aspects relates to, a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide to resin, A still further aspect relates to and a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.

Carbon fiber-reinforced polimide resin composition

A preparation process of solid polyhydroxycarboxylic acid comprising subjecting an organic solvent solution of polyhydroxycarboxylic acid to cooling.cndot.solidification and grinding. The preparation process can provide high molecular weight solid polyhydroxycarboxylic acid with ease and cheaply, can be converted with ease to a continuous system, and is useful in industry.

A purification process for polyhydroxycarboxylic acids which comprises dissolving polyhydroxycarboxylic acid in an water-immiscible phenol or an organic solvent containing said water-immiscible phenol, successively bringing the resulting solution into contact with water which contains an acidic material, separating the organic layer from an aqueous layer, and isolating polyhydroxycarboxylic acid from the organic layer. The process can efficiently remove a catalyst contained in the polyhydroxycarboxylic acid prepared in the presence of the catalyst, does not require polyhydroxycarboxylic acid to be in the form of a solid, and can treat polyhydroxycarboxylic acid in a higher concentration as compared with using chlorinated hydrocarbon as a solvent.

Purification process of polyhydroxycarboxylic acid

A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.

Bisimide compounds, polyimide resin composition prepared therefrom, and

Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

Resin forming compositions

A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Polyimide based resin composition comprising cured phenolic resins and

A preparation process of polyhydroxycarboxylic acid having an inherent viscosity of 0.3 dl/g or more by dehydrating polycondensation of lactic acid containing hydroxycarboxylic acid in an organic solvent in the presence or absence of a catalyst, comprising using a hydroxycarboxylic acid raw material which comprises one or more impurities selected from the group consisting of methanol, ethanol, acetic acid, pyruvic acid, fumaric acid, methyl lactate, ethyl lactate and butyl lactate in a total amount of 0.3% by mole or less for the amount of said hydroxycarboxylic acid raw material.

Lactic acid containing hydroxycarboxylic acid for the preparation of

In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride. In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide. In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer. In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

Polyimides, process for the preparation thereof and polyimide resin

Bismaleimide compounds

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Yokohama, Japan

Masahiro Ohta