Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi Microcomputer Engineering, Ltd.

Hitachi Ulsi Engineering Corp.

Vlsi Engineering Corporation

Hitachi Ltd., and Hitachi Vlsi Engineering Corp.

Masahiro Ogata

Katsuyuki Sato

Sadayuki Ohkuma

Miki Matsumoto

Masahiro Yoshida

Kanehide Kenmizaki

Kikuo Sakai

Michitaro Kanamitsu

Nobuo Kato

Kiichi Manita

Takeshi Kajimoto

Yutaka Shimbo

Shouji Kubono

Satoshi Meguro

Isamu Kobayashi

Toshifumi Takeda

Hiroshi Kawamoto

Takashi Shinoda

Kouichi Nagasawa

Hisahiro Moriuchi

Ryuuji Shibata

Youichi Matsumoto

Yoshiaki Onishi, Deceased

Hideo Meguro

Shoji Kubono

Masaya Muranaka

Yukihide Suzuki

Makoto Morino

Sinichi Miyatake

Shoji Wada

Yoshihisa Koyama

Tetsuya Kitame

Hidetomo Aoyagi

Osamu Sakai

Masahiro Katayama

Nobuhiko Ohno

By Junko Onishi, Administratrix

Seiichi Shundo

Junko Onishi, Administratrix

A defect remedy LSI mounted on a memory module, comprising: an input interface portion for capturing address and control signals, the input interface portion being the same as that of a dynamic RAM; an input/output interface portion corresponding to a data bus of a memory device comprised of a plurality of dynamic random access memories; a memory circuit to which a chip address and an X defective address of any of the plurality of random access memories are electrically written, the memory circuit being substantially made nonvolatile; a redundancy remedy RAM portion composed of a static RAM wherein a word line is selected by a compare match signal between an X address signal and the defective address of the memory circuit, the X address signal and the defective address being captured via the input interface portion, and a column is selected by a Y address signal captured via the input interface portion; a selecting portion for connecting a data input/output bus of the redundancy remedy RAM portion to an input/output circuit corresponding to a defective chip address; a data input/output portion for selectively activating an input/output circuit to be connected to a data bus corresponding to a dynamic RAM found defective; and a mask portion for outputting a control signal for putting in a high-impedance state an output pin of the defective RAM in a read operation.

Semiconductor memory system

A multiport memory is provided which permits both random access and serial access. In order to reduce parasitic capacitance and improve operating speed, the serial input/output lines are each divided into two parts at their middle points. Sense amplifiers for the serial input/output lines are provided at upper and lower ends of the serial access memory elements to respectively amplify signals from the divided lines. Additional features are provided for improving both the serial and random operation. For example, during the serial read mode, the column selector for random access is simultaneously operated, and read data passing through the random access column selector is used as head data for the serial output operation to be delivered through the serial output circuit. Also, a serial selector can be controlled by a select signal formed by a Gray Code counter to improve operating speed. Further features included a redundancy system for relief of defective bits, the use of common bit lines to improve integration density and an improved refreshing arrangement to reduce power consumption during the refresh mode.

Semiconductor memory device

The semiconductor memory is facilitated with control circuitry for effecting plural self-refresh modes having respectively different refresh periods. The plural self-refresh modes are typified by a PS (pseudo) refresh mode which is applied when the memory is in the nonselected state for a comparatively long period of time, such as in the state in which memory backup is being facilitated, and by a VS (virtual) refresh mode in which the refreshing operation of the memory cells is effected intermittently during the intervals of memory accessings. The pseudo refresh mode has a longer refresh time period than the virtual refresh mode. The control circuitry also has counter circuits for the generating of refresh address signals in accordance with a first timing signal indicative of a pseudo refresh mode and a second timing signal indicative of a virtual refresh mode, the latter timing signal being a higher frequency signal. Such availability of plural self-refresh modes becomes particularly advantageous when considering consumption of the back-up power for maintaining the IC memory device versus stability of stored data. While the consumption of the back-up power for maintaining the device would be relatively lower under one of the self-refresh modes, namely, the PS (pseudo) refresh mode, the stability of data stored would, however, be greater under another self-refresh mode, namely, the VS (virtual) refresh mode.

Semiconductor memory device facilitated with plural self-refresh modes

There is provided in connection with a semiconductor memory, such as of the pseudostatic RAM, a layout of the circuit components thereof including a method of testing the memory. There is provided an oscillation circuit which is capable of withstanding bumping of the power source voltage (varying) which effects stabilization regarding the operation of the circuits included therewith including a refresh timer circuit. There is also provided for testing a refresh timer circuit and a semiconductor memory which includes a refresh timer circuit. There is further provided for an output buffer which is capable of high speed operation with respect to memory data readout, a voltage generating circuit which is capable of stable operation and a fuse circuit, such as provided in connection with redundant circuitry in the memory and which is characterized as having a configuration of a fuse logic gate circuit employing complementary channel MOSFETs together with a fuse. With respect to the semiconductor memory, such as the pseudostatic RAM, the initial count of the refresh timer counter circuit of the refresh timer circuit can be set at an optional value by applying a signal to an address input terminal, and a test mode can be effected in which the refresh period can be set at an optional value by accordingly applying a test control signal to a predetermined external terminal. Therefore, the discharge current of the oscillation circuit capacitor associated with the refresh timer circuit becomes stabilized, noting the particular layout arrangement regarding the polycrystalline silicon layer forming the resistor of the oscillation circuit, and the fact that same parasitic capacitances are effectively connected between the polycrystalline silicon resistor and the supply voltage of the circuit and between the polycrystalline silicon resistor and the ground potential of the circuit thereby cancelling any variation of the output of the power source. Therefore, variation of the oscillation frequency of the oscillation circuit attributable to the bumping of the power source can be effectively suppressed.

Semiconductor memory, components and layout arrangements thereof, and

A data output buffer is provided in connection with a semiconductor memory, such as a pseudostatic RAM, which is capable of high speed operation with respect to memory data readout. The buffer includes a latch circuit comprising a pair of NAND gate circuits having input and output terminals connected in cross connection, a pair of precharge MOSFETs provided respectively between the noninverted and inverted input terminals of the latch circuit, a pair of CMOS NAND gates which transfer the inverted signal of the latch circuit according to an inverted timing signal and a pair of series-connected MOSFETs effecting a pull-up/pull-down arrangement which receives the inverted signal of the output signal of the NAND gates.

Data output buffer for a semiconductor memory

A multiport memory is provided which permits both random access and serial access. In order to reduce parasitic capacitance and improve operating speed, the serial input/output lines are each divided into two parts at their middle points. Sense amplifiers for the serial input/output lines are provided at upper and lower ends of the serial access memory elements to respectively amplify signals from the divided lines. Additional features are provided for improving both the serial and random operation. For example, during the serial read mode, the column selector for random access is simultaneously operated, and read data passing through the random access column selector is used as head data for the serial output operation to be delivered through the serial output circuit. Also, a serial selector can be controlled by a select signal formed by a Gray Code counter to improve operating speed. Further features include a redundancy system for relief of defective bits, the use of common bit lines to improve integration density and an improved refreshing arrangement to reduce power consumption during the refresh mode.

A mask-programmed ROM includes depletion type load MOSFETs provided between data lines in a memory array and a power supply voltage, the MOSFETs having a ground potential of the circuit applied to their gates. Reading of data is carried out by an amplifying MOSFET which supplies a current to a selected data line through a depletion type MOSFET which is supplied at its gate with the circuit ground potential. Thus, bias voltages which are respectively applied to the data lines and a sense amplifier which receives a signal read out from a selected data line are made equal to each other, thereby achieving a high-speed read operation.

Read-only memory

A semiconductor memory includes a dummy cell for forming a reference potential, a read-only memory cell, and a differential amplifier circuit which receives the reference potential formed by the dummy cell and a signal read out from the memory cell. The differential amplifier circuit is dynamically operated so that the semiconductor memory is made smaller in power consumption and size than conventional units. Moreover, in order to reduce the power consumption, the memory cell is brought into the nonselection state when a predetermined time has passed after being selected. In addition, the semiconductor memory is provided with a compensating circuit in order to make the value of the capacitance connected to a word line for transmitting a selecting signal to the memory cell and the value of the capacitance connected to a dummy word line for transmitting a selecting signal to the dummy cell substantially equal to each other. Thus, the changes in potential of both the selecting signals are made substantially equal to each other. Accordingly, it is possible to reduce malfunctions.

Semiconductor device having head only memory with differential amplifier

YA semiconductor memory is provided with memory cells for storing a plurality of sets of data, each of the sets having check bits. A selecting circuit selects some of the memory cells to form a set in response to a first address signal. The circuit includes an error correcting code circuit, a tristate circuit and a control circuit which forms a control signal to control the tristate circuit. Output terminals of the tristate circuit are coupled with external output terminals of the semiconductor memory. Also, the tristate circuit is controlled by the control signal to bring the external circuit terminals into high impedance at least during the time when the error correcting code circuit is delivering indefinite data.

Semiconductor memory

In the past, it has been a problem in integrated circuits using MOSFETs that the gate insulating film of a transmission gate MOSFET is broken down when an abnormally high voltage such as is caused by frictional static electricity is applied to its drain region. This breakdown of the gate insulating film cannot be prevented merely by limiting the voltage level applied to the drain region to a level below the breakdown withstand voltage of the gate insulating film. The reason for this is that even with such voltage limiting, the breakdown of the gate insulating film can still occur when local heating is generated by a relatively large breakdown current flowing through the drain junction. To prevent such a breakdown of the gate insulating film, therefore, a resistance element for limiting the breakdown current is connected in series with the drain region of the transmission gate MOSFET.

Semiconductor integrated circuit device

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Fussa, Japan

Masahiro Ogata