Akebono Brake Industry Co., Ltd.

Other

Nihon Inter Electronics Corporation

Akebono Research and Developement Centre Ltd.

Nihon Inter Electronic Corporation

Masahiro Nezu

Masatomo Mori

Takashi Kunimi

Tadao Matsunaga

Rokurou Naya

Shougo Suzuki

Masayoshi Esashi

Tadashi Kobayashi

Kimio Takahashi

Katsuya Miyake

Tatsuo Ogawahara

Takashi Kurosawa

Kazuya Kato

Akihiro Azuma

To improve a response rate and an impact detection precision of an auxiliary acceleration sensor device for an air bag system, an auxiliary acceleration sensor device includes a longitudinal G sensor for sensing a longitudinal acceleration G of a vehicle, and lateral G sensor for sensing a lateral acceleration G of the vehicle. The longitudinal G sensor includes a constant current source circuit, a detector portion for outputting an electrical signal representative of a longitudinal acceleration G, and an amplifier portion for amplifying the signal received from the detecting portion. The comparator includes comparing elements that compare the voltage values corresponding to longitudinal threshold values Tf to Tf of the longitudinal acceleration G with an output signal of the amplifier portion. Lateral G sensor includes a constant current source circuit, a detector portion for outputting an electrical signal representative of a lateral acceleration G, and an amplifier portion for amplifying the signal received from the detecting portion. Comparator means includes comparing elements which compare the voltages corresponding to lateral threshold values Ts to Ts of the lateral acceleration G with the output signal of the amplifier portion. An OR circuit coupled for reception with the comparator means outputs a signal to a main controller of an air bag control system when predetermined conditions are satisfied.

Auxiliary acceleration sensor device for an air bag system

Semiconductor acceleration sensor and its self-diagnosing method

A semiconductor acceleration sensor including a central board having a movable electrode section, an outside board having a stationary electrode section, and a sealing insulating section for joining the central board and the outside board which are laminated on each other, wherein the sealing insulating section has a conductive layer, and the conductive layer is a sealing member or an anodic bonding electrode.

Semiconductor acceleration sensor and manufacturing method thereof

An acceleration sensor includes a first substrate, a second substrate and a third substrate. The second substrate has a through-hole, a first contact formed on an inner surface of the through-hole, and a first bonding pad connected to the first contact. An electrically conductive ball is accommodated in the through-hole. The third substrate has a recess, a second contact formed in the recess contacting the bottom of the electrically conductive ball, and a second bonding pad connected to the second contact.

Acceleration sensor and method for manufacturing thereof

A semiconductor acceleration sensor comprising a rectangular semiconductor substrate on the moving electrode side and a rectangular semiconductor substrate on the fixed electrode side laminated on each other, the moving electrode side substrate being formed with a heavy weight and a thin cantilever, a moving electrode being provided on the heavy weight, a first electrostatic attraction electrode being provided on the cantilever, the fixed electrode side substrate being formed with a fixed electrode at a position opposed to the moving electrode and a second electrostatic attraction electrode at a position opposed to the electrostatic attraction electrode. The first and second electrostatic attraction electrodes are placed facing each other. A predetermined spacing is provided between the electrostatic attraction electrodes and a predetermined voltage is applied therebetween.

Semiconductor acceleration sensor using semiconductor microworking

In a semiconductor acceleration sensor, a weight and thin beam parts adjacent to the weight are formed on a substrate, a moving electrode is formed on the weight, and a fixed electrode is formed at a position of the other substrate opposed to the moving electrode. Both the electrodes come in contact with each other and conduct as a result of acceleration on the weight, whereby the semiconductor acceleration sensor operates. The fixed electrode or the moving electrode is formed with a projection toward the opposed electrode and the projection and the electrode come in contact with each other and conduct by action of acceleration with a predetermined spacing held between both the electrodes for preventing occurrence of chattering caused by the electrostatic attraction force between both the electrodes.

Semiconductor acceleration sensor

A small-sized, reliable, low-cost acceleration sensor includes a working mechanism having a large joint surface. In this respect, an acceleration sensor 1 is arranged so that a diaphragm portion 2D is formed on a (100) face of a plate of single crystal silicon. The four corner portions of the joint surface 2A of a square frame are expanded in the center direction of the plate of single crystal silicon so as to form expanded portions 2B. Moreover, the (100) face of the square plate of single crystal silicon is covered with a mask having at least an octagonal opening 10E before being subjected to anisotropic etching, so that the expanded portions 2B directed to the center portion are formed in the respective four corner portions of the plate of single crystal silicon.

Acceleration sensor

An acceleration sensor is based on a semiconductor technique which is suitable for mass production. The resulting acceleration sensor is small in size and high in precision. The acceleration sensor includes a stationary section, an acting section to which a force is applied in response to acceleration, a flexible section through which the stationary section is coupled to the acting section, a plurality of distortion sensing elements coupled to the flexible section, a first weight having a bottomed hole which is gradually smaller in width towards the bottom of the hole, the first weight being coupled to the acting section and a second weight, greater in specific gravity than the first weight, coupled to the bottom of the hole of the first weight.

A brake control system for a vehicle in which a brake pressure is generated in accordance with a signal from an electronic control unit for applying the brake pressure to vehicle wheels, characterized in that a mechanical brake system is automatically actuated when an unexpected electrical fault has occurred in an electrical brake system.

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Saitama, Japan

Masahiro Nezu