Idemitsu Petrochemical Co., Ltd.

Masahiro Nakamichi

Shinobu Yamao

Masami Mihara

Shinichi Miura

Taizou Sugioka

Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.

Styrenic resin composition and semiconductor carrier device

The present invention provides an injection molded food container which is produced by injection molding a polyarylene sulfide resin composition containing 20-70% by weight of glass fiber or glass fiber and other inorganic filler and is excellent in heat resistance, oil resistance and mechanical strength and is suitable as a food container used in microwave oven and convection oven having a heater. The injection molded food container can be manufactured by injection molding a polyarylene sulfide resin composition containing 20-70% by weight of glass fiber or glass fiber and other inorganic filler, using metal mold of which surface roughness is not greater than 5 .mu.m, under condition of mold temperature 130.degree.-180.degree. C.

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Tokyo, Japan

Masahiro Nakamichi