Matsushita Electric Industrial Co., Ltd.

Masahiro Nagasawa

Hiroshi Yamazoe

Masaki Aoki

Masahide Tsukamoto

Shigeru Yoshida

Yo Hasegawa

Tomio Ishida

Yoshitaka Yoshikawa

Koichi Azuma

Noboru Nomura

Tohru Nakagawa

Osamu Kawasaki

Katsuhiko Kumagawa

Shigeo Suzuki

Hidenobu Shintaku

Yasuo Wakahata

Hirofumi Tajika

Isao Ota

Tadashi Ootake

Toshio Tatsumichi

Hiroshi Fukushima

Kensuke Kuchiba

Kunio Nishi

Hiroshi Abe

A display device using a cylinder-shaped pixel having a large dipole moment and high response speed and a method for manufacturing the same. In the display device, an organic film is bonded and fixed to a part of or an entire surface of a base material having a volume of less than 1 cmvia &#x2014;A&#x2014;O&#x2014; bond, where A denotes Si, Ge, Sn, Ti or Zr, or via &#x2014;A&#x2014;N&#x2014; bond, where A denotes Si, Ge, Sn, Ti or Zr, in the former, the side of O is bonded to the substrate and in the latter, the side of N is bonded to the substrate; the surface region of the base material is divided into two regions in accordance with the kind of organic films or the presence or absence of the organic film, and each of the two regions accounting for 40% or more and 60% or less of the surface area of the base material, a plurality of charged substances in different charged states or with opposite polarities in the two regions. The plurality of charged substances are dipped in liquid between a pair of substrates each having an electrode, and voltage is applied to the electrode, thereby enabling the charged substances to be rotated.

Display device and method for manufacturing the same

The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.

Diffusion joining method and a paste used therefor

Protrusions made of an electrically conductive material such as a metal or ceramic are formed around a node point or a node line of vibrations of a piezoelectric plate on two principal planes thereof by a spraying process. The piezoelectric plate is held at the protrusions with leaf springs on the two principal planes. Thus, protrusions of a small surface area are formed without deteriorating the piezoelectric plate. The piezoelectric plate can be held stably without deteriorating the vibration characteristics. An alternating voltage is applied to electrodes of the piezoelectric plate through the electrically conductive protrusions. Because a spraying process is used, the protrusions can be thickly and precisely formed in a small area and held surely and reliably, with a good mechanical strength of the protrusions.

Holding structure for a piezoelectric vibrator

The copper or its alloys can be bonded to each other or can be bonded to noble metals or to other metals whose surface is covered with a noble metal thin film in an oxidative atmosphere. The surface of the copper or its alloys to be bonded should be covered with the layer of a noble metal thin film or a metal oxide remover or a conductive paste mainly consisting of a copper or copper alloy particles and the metal oxide remover. This method can be applied to a metallurgical industry and also to an electronics industry. This method is especially suitable for the production of a multilayered printed wiring board.

Methods for joining copper or its alloys

A method of producing a substrate structure for a large size display panel. The method involves conveying a transparent substrate from a transparent substrate storage means in a conveying path through a vacuum chamber, and while conveying the substrate, forming at least a patterned transparent conductive film on a surface of the substrate by depositing strips of conductive film on the substrate through a pattern containing member extending in a direction orthogonal to the substrate conveying direction and having strip forming openings therein at intervals along the lengths thereof, and storing the transparent substrates with the strips thereon at the end of the conveying path.

Method of producing a substrate structure for a large size display panel

A cantilever for a pickup cartridge comprising a base in the form of a solid rod or a pipe coated with a layer of a substance exhibiting a high modulus of elasticity ratio higher than 5000 Kg/mm.sup.2. The substance is for example boron or a boride.

Cantilever for pickup cartridge

This invention relates to a boron cantilever in pipe form, composed of an inner layer of crystal boron and an outer layer of amorphous boron and to a method for producing it. The cantilever is particularly useful for supporting a phonographic pickup stylus.

Boron cantilever pipe

Method of making boron cantilever

A cantilever for a pickup cartridge comprising a base in the form of a solid rod or a pipe coated with a layer of a substance exhibiting a high modulus of elasticity ratio higher than 5000 Kg/mm.sup.2. The substance is for example boron or a boride. Described also is a process for manufacture of cantilevers wherein low pressure chemical vapor deposition or plasma chemical vapor deposition is used to cause the reaction between boron trichloride (BCl.sub.3) and hydrogen (H.sub.2) gases, thereby depositing boron or a boride on a base.

Process for manufacture of cantilever for pickup cartridge

To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.

Surface acoustic wave filter

A resin-bonded graphite body having controlled crystalline orientation and a density of at least 2.05 g/cm.sup.3, the body comprising 3 to 12 weight % of a thermosetting resin and 88 to 97 weight % of a carbonaceous powder, is provided which includes at least 50 weight % of natural crystalline graphite powder. The body has a high transverse strength and a very low electrical resistance in the direction parallel to the direction of the crystalline orientation, and is thus suitable for a dry battery electrode.

Resin-bonded graphite body for a dry battery and method of making the

A resin-bonded graphite body having controlled crystalline orientation and a density of at least 2.05 g/cm.sup.3, the body comprising 3 to 12 weight % of a thermosetting resin and 88 to 97 weight % of a carbonaceous powder which includes at least 50 weight % of natural crystalline graphite powder, is provided. The body has a high transverse strength and a very low electrical resistance in the direction parallel to the direction of the crystalline orientation, and is thus suitable for a dry battery electrode.

Resin-bonded graphite body for a dry cell

A voltage-dependent resistor (varistor) of the bulk type comprising a sintered body consisting essentially of, as a main constituent, ZnO and additives of various metal oxides and further containing an additive of at least one of Al.sub.2 O.sub.3, In.sub.2 O.sub.3 Ga.sub.2 O.sub.3 provide much improved characteristics, especially superior limiting voltage ratio, surge resistance and life of the varistor.

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Hirakata, Japan

Masahiro Nagasawa