Disco Corporation

Sony Corporation

Honda Motor Co., Ltd.

Kabushiki Kaisha Toshiba

Masahiro Murata

Hiroshi Watanabe

Satoshi Kobayashi

Yusuke Nagai

Hiroshi Morikazu

Akira Yajima

Yukio Morishige

Naoki Ohmiya

Takayuki Ogawa

Hitoshi Takahashi

Tatsuya Sakai

Tatsuya Shinoda

Kengo Kurata

Kenichiro Kurai

Yasuaki Murashi

Kento Aono

Akihito Yajima

A spoke angle deviation amount measuring system () includes a first to fourth support units () to () configured to support rotatably a first to fourth tires () to (), respectively. Shaft portions () of the support units () to () are positioned by positioning caps () after a vehicle () is moved to a measuring position with a steering wheel () positioned neutral. With the tires () to () inclined at a toe angle with respect to a front-and-rear direction, when the vehicle () is caused to travel forwards, lateral stress is exerted on the support units () to (), whereby the support units () to () turn about the corresponding shaft portions (). An angle sensor () detects turning angles of the support units () to (). A control device () calculates a spoke angle deviation amount based on the detected turning angles.

Spoke angle deviation amount measuring system

A method of carrying out laser processing along processing lines having linear portions and curved portions formed on a workpiece by using a laser beam processing machine comprising a laser beam application means for applying a laser beam to the workpiece held on a chuck table which comprises a condenser for converging a laser beam, having a focal spot changing means for changing the shape of a focal spot between an elliptic spot and a circular spot, comprising the steps of: moving a processing line formed on the workpiece to the application position of a laser beam, activating the focal spot changing means to make an elliptic focal spot and positioning the long axis of the elliptic spot along a linear portion of the processing line when the linear portion of the processing line is located at the application position of the laser beam and activating the focal spot changing means to make a circular focal spot when a curved portion of the processing line is located at the application position of the laser beam.

Laser processing method and laser beam processing machine

A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.

Wafer dividing method

A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.

An LED display apparatus capable of reliably preventing damage caused by static electricity without worsening the visual recognition, in which an the display surface of the LED display apparatus is mounted an electrically conductive plate having a thickness nearly equal to, or smaller than, the height of the light-emitting portions L in a direction Z perpendicular to the display surface and having holes perforated at positions corresponding to the positions of the light-emitting portions L on the display surface. The electrically conductive plate is grounded, and a current due to the electrostatic discharge flows from the electrically conductive plate into ground.

Flat display apparatus

Growing community of inventors

Tokyo, Japan

Masahiro Murata