Sumco Corporation

Nec Network and Sensor Systems, Ltd.

Masahiro Murakami

Norio Masuda

Ryoya Terakawa

Takahiro Nagasawa

A method of polishing a silicon wafer, including a final polishing step including a pre-stage polishing step and a subsequent finish polishing step. The finish polishing step in the final polishing step includes a finish slurry polishing step using a polishing solution having an abrasive grain density of 1×10/cmor more as the second polishing solution; and a pre-polishing step using a polishing solution having an abrasive grain density of 1×10/cmor less as the second polishing solution, the pre-polishing step being performed prior to the finish slurry polishing step. A method of producing a silicon wafer, including the steps of: forming a notch portion on a periphery of a single crystal silicon ingot grown by the Czochralski process; slicing the ingot to obtain a silicon wafer; and subjecting the resulting silicon wafer to the above method of polishing a silicon wafer.

Method of polishing silicon wafer and method of producing silicon wafer

Provided is an evaluation method of a semiconductor wafer having a polished surface, the method including a cleaning process of cleaning the semiconductor wafer with one or more kinds of cleaning liquid, measuring an LPD of the polished surface both before and after the cleaning process with a laser surface inspection device, and distinguishing the type of defect or foreign substance measured as the LPD, based on measurement results obtained in the measuring, according to distinguishing standards shown in Table A.

Semiconductor wafer evaluation method and manufacturing method and semiconductor wafer manufacturing process management method

To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamberhouses the high voltage power supply module(the first electronic component). A second electronic component housing chamberhouses the TWT(the second electronic component). At least some of a first partition plateand a second partition plateare provided so as to face each other. A first gap part Gis provided between the first partition plateand the second partition plate

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Tokyo, Japan

Masahiro Murakami