Mitsubishi Electric Corporation

Masahiro Motooka

Junya Suzuki

Katsuhiko Omae

Muneaki Mukuda

Shunsuke Fushie

Daisuke Nakashima

Takanobu Kajihara

Hiroyuki Miyanishi

Yuki Nakamatsu

Teruo Miyamoto

Mitsuhiro Shirota

Tetsuya Tazawa

Yohei Kawahara

Isao Okano

Shinsuke Nakahata

In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Semiconductor device

In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

In an indoor equipment of an air conditioner in which a heat exchanger, a blower, and a drain pan receiving a drain water having been condensed at mentioned heat exchanger below the heat exchanger are contained in an internal part of the indoor equipment housing including an air inlet and an air outlet; and a back portion of the drain pan is faced to an air flow path communicating with mentioned air outlet, and a stabilizer is disposed at an end portion on the upstream side of the air flow path of this drain pan, the drain panis integrally formed of a drain pan bodyand a stabilizer portionby injection molding; and a concave portionis formed on the air flow path side in the vicinity of the boundary between the drain pan body and the stabilizer portion.

Indoor equipment of air conditioner

Growing community of inventors

Tokyo, Japan

Masahiro Motooka