Tdk Corporation

The Yokohama Rubber Co., Ltd.

Asahi Glass Company, Limited

Hitachi Metals, Ltd.

The Furukawa Electric Co., Ltd.

Japan Aerospace Exploration Agency

Mitsubishi Heavy Industries Thermal Systems, Ltd.

Swcc Showa Cable Systems Co., Ltd.

Institute for Laser Technology

Tdk Xiamen Co., Ltd.

Mitsubishi Research Institute, Inc.

Tadashi Miyamoto

Zenshin Electric Power Engineering Company, Ltd.

Swcc Showa Cable System Co., Ltd.

Zenshin Electric Power Engineering Inc.

Masahiro Mori

Norihisa Ando

Sunao Masuda

Kayou Matsunaga

Kosuke Yazawa

Katsumi Kobayashi

Kayou Kusano

Atsushi Sato

Kenichi Inoue

Kiyoshi Miura

Yoshinori Yoshida

Masahiko Nagahama

Shirou Hasegawa

Tomoyoshi Fujimura

Kenji Kamiya

Masahiro Ichikawa

Hiroto Nozaki

Hideo Kobayashi

Makoto Hasegawa

Makoto Hattori

Shinya Ito

Hiroto Higuchi

Hiroyuki Kamitani

Akihiro Masuda

Masanori Kosuda

Kyohei Watanabe

Mitsuo Osawa

Mitsuyuki Tatemura

Tatsuya Iijima

Hiroyuki Nagayama

Katsushi Kamijyo

Toshimasa Kakiuchi

Kazuo Imasaki

Jin Murakami

Toshiyasu Satoh

Takayuki Sakai

Katsushi Miyake

A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.

Ceramic electronic component

A pipe joint connecting a first pipe having conductivity and being grounded and a second pipe including a corrugated metallic pipe member and a conductive layer having lower electric resistance than metal forming the pipe member and covering the pipe member, the pipe joint including a connection part that has conductivity and is connected to the first pipe, a housing part that has conductivity, is engaged with the connection part, and houses the second pipe inside the housing part by insertion of the second pipe along an axis direction of the second pipe, and a conductive member that includes a first part in contact at least partially with the housing part and a second part exposed to an outside of the housing part to be in contact with the conductive layer.

Pipe joint

A tube includes a corrugated metal tubular member; and a first covering part that covers the outside of the tubular member, and forms a braided structure using a resin string member of which at least a part is covered by a metal having lower electrical resistance than that of a metal forming the tubular member. The tube can also include a third covering part made of an insulating resin arranged between the tubular member and the first covering part, and covers the tubular member, wherein the first covering part covers the third covering part.

Tube

A current estimating device that estimates a capacitor current of a high-voltage circuit for driving a motor, wherein the current estimating device calculates a voltage utilization rate using the input voltage of an inverter included in the high-voltage circuit and the speed of the motor, calculates a first constant by applying the voltage utilization rate to a predetermined first arithmetic expression, and calculates the capacitor current of an electrical condenser included in the high-voltage circuit by multiplying the first constant by a motor current effective value.

Current estimating device, electric compressor, current estimating method, and motor current effective value estimating method

An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.

Electronic device

An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.

An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

Electronic device assembly

A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

Method of manufacturing electronic device and the same

An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.

An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.

A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

Ceramic electronic device

An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.

An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.

An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.

Growing community of inventors

Tokyo, Japan

Masahiro Mori