The Furukawa Electric Co., Ltd.

Masahiro Meguro

Kenya Kawabata

Hiroshi Sakai

Shinichi Ito

Yasuyuki Tochigi

Hung Wei Tseng

Kuang Yu Chu

Yoshikatsu Inagaki

Masaaki Yamamoto

Hirofumi Aoki

Masato Watanabe

Hideaki Kawabata

Ryo Tsubata

A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.

Heat sink

A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.

Cooling device with superimposed fin groups

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.

A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

Cooling device with superimposed fin groups and parallel heatpipes

Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.

A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.

Growing community of inventors

Tokyo, Japan

Masahiro Meguro