Sharp Kabushiki Kaisha Corporation

Masahiro Konishi

Toshio Hata

Shin Itoh

Makoto Agatani

Takanobu Matsuo

Hiroyuki Nokubo

Masaki Kondo

Kiyohisa Ohta

Takaaki Horio

Hiroki Orita

Ippei Yamaguchi

Yoshiaki Itakura

Taiji Morimoto

Yuhsuke Fujita

Masatsugu Masuda

Masayuki Ohta

Toshiyuki Takada

Yusuke Fujita

Takashi Nakanishi

Masanao Kiba

Kazuo Tamaki

Masanobu Okano

Kazuhiro Okamoto

Yasuji Takenaka

Hiroshi Yamashita

Hiroshi Umeda

Masaharu Kitano

Tomoshi Kimura

Masayuki Itoh

Toshiro Hida

Masako Yabe

An electrode pattern () formed on a ceramics layer () in a substrate for a light emitting device (circuit board ()) of the present invention includes a first metal layer (), a second metal layer (), and an electrode terminal unit (), and the thickness of a part at which the electrode terminal unit () is not formed in the electrode pattern () is at least equal to or greater than 35 &#x3bc;m. Accordingly, it is possible to suppress heat resistance to be low.

Substrate for light emitting device and manufacturing method of substrate for light emitting device

A substrate (A) includes an aluminum substrate body (), a reflection layer () that is formed between an electrode pattern () which obtains electrical connection with a light emitting element () and the aluminum substrate body () and that contains first ceramics which reflect light from the light emitting element (), and an intermediate layer () that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer ().

Substrate for light emitting devices, light emitting device, and method for producing substrate for light emitting devices

A lighting reflectorincludes a base member, made of metal, having an inner circumferential surfaceexpanding toward a light exit apertureopen at an end in an axial direction. A thin-film layerwhich is formed from a thin film containing ceramic and which scatters light is placed on an end portion of the inner circumferential surfacethat is on the opposite side to the light exit aperture

Lighting device, lighting reflector and production method therefor

A substrate () in which a surface of an aluminum base () other than a surface on which an insulating thin film layer () is formed is covered with a protective layer () which is an aluminum anodic oxide film.

Substrate for light emitting device, light emitting device, and method for manufacturing substrate for light emitting device

In a light-emitting device substrate (), a light reflecting surface covered with an anodized aluminum layer () is formed on one side of a base (), and a glass-based insulator layer () and electrode patterns () disposed on the first insulating layer () are formed on the one side of the base () in a region not covered with the anodized aluminum layer (). A glass-based insulator layer () is formed at least on the other side of the base () that is opposite the one side of the base (). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.

Light-emitting device substrate, light-emitting device, and method for producing light-emitting device substrate

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Light emitting device and method for manufacturing the same

A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.

Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate

A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Light-emitting apparatus

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate () includes an intermediate layer () containing ceramic which is formed on the surface of the aluminum base () by using an aerosol deposition method.

Substrate for light emitting devices and light emitting device

A ceramic insulating film () having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (), and a light emitting element () is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus () having the light emitting element () provided on the substrate ().

Light emitting apparatus

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate () for a light emitting device includes: a first insulating layer () having thermal conductivity which is formed on a surface of one side of a metal base (); a wiring pattern () which is formed on the first insulating layer (); and a second insulating layer () having light reflectivity which is formed on the first insulating layer () and on some parts of the wiring pattern (), so that some parts of the wiring pattern () are exposed, in which the first insulating layer () is a layer of ceramic formed by thermal spraying.

Substrate for light emitting device, light emitting device, and manufacturing method of substrate for light emitting device

A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

In a light-emitting device (), a wiring pattern including conductor wirings () and electrodes () is formed on a substrate (), and an Au layer () is formed on the wiring pattern.

Light-emitting device

A method for manufacturing a light-emitting device of the present invention includes a step in which solid-state sealing resin () containing a phosphor () and the solid-state sealing resin () containing a phosphor () are arranged in recesses in package resin () having LED chips placed thereon, are thereafter melted by heating, and, in addition, are cured by heating.

Growing community of inventors

Osaka, Japan

Masahiro Konishi