Denso Corporation

Tokin Corporation

Masahiro Kondou

Takashi Kawashima

Ryota Tanabe

Naoki Hirasawa

Takashi Yanbe

Shigemi Itou

Yosimi Nakase

A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

Power conversion apparatus provided with semiconductor module and electronic component pressurized by pressurizing member

A conductive member is disposed between a secondary spool and a high tension terminal to shield the wire connecting the secondary coil and the high tension terminal. The conductive member has a wide surface facing the low tension components to moderate the electric field strength around low tension components, thereby preventing treeings from growing in the insulating filler of the ignition coil.

Ignition coil for internal combustion engine

Growing community of inventors

Sendai, Japan

Masahiro Kondou