Nec Electronics Corporation

Sony Corporation

Renesas Electronics Corporation

Masahiro Koike

Hirochika Narita

Shota Nishi

Yuji Yakura

Yasuhiro Tanaka

Kenichi Kurihara

The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed between the semiconductor chip and the heat spreader and covering the semiconductor chip. The heat spreader is not in contact with any of the substrate and the semiconductor chip, and has an opening.

Semiconductor device having heat spreader with center opening

A liquid ejection device includes: a liquid ejection head which includes an ejection surface and an ejection port formed at the ejection surface, ejects a droplet of liquid from the ejection port, and allows the liquid to land on an object; an elastic absorbing member which comes into contact with the ejection surface of the liquid ejection head, and absorbs the liquid adhering to the ejection surface; and moving means for moving the absorbing member with respect to the ejection surface while the absorbing member is in contact with the ejection surface, in which the absorbing member has a surface layer which is impregnated with a solution containing a surfactant.

Liquid ejection device

To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sinkhaving a one-dimensional CCD elementmounted thereon. The thermal coefficient of expansion of the heat sinkis matched with that of a hollow molded casefor integrally molding the heat sinkand a lead frame. A plurality of projectionsformed on the side of the hollow molded caseare disposed at a bonding interface between the glass capwhich closes an upper opening of the hollow molded caseand side walls of hollow molded case

Resin molded semiconductor device and mold

To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. A resin molded semiconductor device including a heat sink having a support face with a semiconductor chip mounted thereon electrically connected to a lead frame, a resin molded case forms a space for accommodating the semiconductor chip therein, and has an opening on an upper face thereof defined by side walls including a plurality of linearly arrayed resin projections above a top surface portion of the side walls, and molds the lead frame and heat sink, and a glass cap closing the opening and secured to the resin molded case by a bonding agent layer. The case has a thermal coefficient of expansion matched with that of the heat sink, and mechanical stress between the case and the cap is absorbed by the bonding agent layer having a thickness greater that the height of the linearly arrayed resin projections above the top surface portion of the side walls.

Growing community of inventors

Kanagawa, Japan

Masahiro Koike