Honda Motor Co., Ltd.

Masahiro Koike

Shin Yoshida

Kenichi Fukami

Izuru Hori

Takuo Kobayashi

Takanori Sato

Naoki Inoue

Toshifumi Matsuda

Makoto Tsuchiya

A first-face forming portion of a workpiece and a second-face forming portion spaced apart from it by the length of an intermediate portion are clamped with a first-face forming die and a second-face forming die, respectively. The first-face forming die is moved either upward or downward and the second-face forming die is moved in a direction toward the first-face forming die, and the second-face forming die is pressed against the first-face forming die to shape the upright wall portion.

Bending method and apparatus for the same

Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.

Laser processing method and laser processing device

A workpiece support apparatus is provided with a plurality of support members. The support members support a workpiece. Each support member moves along a moving path to a machining position while the support member is held at a first holding position for supporting the workpiece or a second holding position which is spaced apart from the first holding position. At least one support member is displaced from the first holding position to the second holding position or from the second holding position to the first holding position along a machining trajectory, before the support member arrives at the machining position whenever each support member is moved to the machining position.

Workpiece support apparatus

A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.

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Tochigi, Japan

Masahiro Koike