Namics Corporation

Matsushita Electric Industrial Co., Ltd.

Smk Corporation

Masahiro Kitamura

Haruhiko Kondo

Akito Yoshii

Masashi Kajita

Kiminori Yokoyama

Noritsuka Mizumura

Yamato Takada

Takeshi Kimura

Michinori Komagata

Harumi Kano

Mitsuru Obo

Hidenori Iida

Shin Teraki

Yoshikazu Ueno

Takayuki Higuchi

A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 &#x3bc;m to 5 &#x3bc;m and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

Conductive paste

The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Shield method for electronic component enclosure and shield material

The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300&#xb0; C. or less and a resin(s).

Electronic part with external electrode

Growing community of inventors

Niigata-ken, Japan

Masahiro Kitamura