Fuji Electric Co., Ltd.

Honda Motor Co., Ltd.

Masahiro Kikuchi

Hiroshi Otsuka

Shin Soyano

Rikihiro Maruyama

Tomohiro Fukazu

Kazunaga Onishi

Takeshi Ichimura

Akira Nishiura

Kosuke Nishiyama

Masafumi Tezuka

Shoji Yokoyama

Takeshi Matsushita

Masaki Takeuchi

Hiroaki Nakahara

Takenori Wada

Masahiro Momose

Yoshio Igarashi

Mitsuhiro Naruse

Kiyohiko Masago

A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.

Heating and cooling device

A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.

Semiconductor device manufacturing method

In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.

Semiconductor device manufacturing method and semiconductor device

Semiconductor device

Growing community of inventors

Matsumoto, Japan

Masahiro Kikuchi