Ngk Insulators, Inc.

Other

Toyota Jidosha Kabushiki Kaisha

Aisan Kogyo Kabushiki Kaisha

Ngk Insulatores, Ltd.

Masahiro Kida

Takahiro Ishikawa

Masayuki Shinkai

Yuji Katsuda

Kiyoshi Araki

Toru Hayase

Shuhei Ishikawa

Takuma Makino

Kenkichi Nagai

Yuki Bessyo

Kenshin Kitoh

Shigeharu Hashimoto

Shingo Iwasaki

Yoshihiro Yamamoto

Ken Suzuki

Naomi Teratani

Toshimasa Ochiai

Shigeki Yamada

Nobuaki Nakayama

Mitsuru Ohta

Yoshiho Tomita

Kazuhiro Osada

Shungo Fukumoto

Takatoshi Ikematsu

Naoyuki Kanetake

Makoto Kobashi

Tomonori Urushihara

An internal combustion engine includes a combustion chamber, a fuel injector injecting fuel into the combustion chamber, a cylinder, a piston having a crown and reciprocating in the cylinder, the crown being exposed to the combustion chamber, and an ignition delay enhancer prolonging an ignition delay of a fuel-air mixture in the combustion chamber. A ceramic member is disposed on at least a fuel injection port, to which fuel is injected from the fuel injector, of the crown of the piston.

Internal combustion engine

A positive crankcase ventilation (PCV) valve mounting structure has a blow-by gas passage with an upstream-side passage portion and a down-stream-side passage portion positioned in a cylinder head and an intake manifold, respectively. The blow-by gas passage may receive the PCV valve therein such that an upstream side portion of a valve case of the PCV valve is positioned within the upstream-side passage portion and that a downstream side portion of the valve case is positioned within the down-stream-side passage portion when the cylinder head and the intake manifold are joined together. A gasket may seal the cylinder head to the intake manifold and may include a seal portion positioned between the valve case of the PCV valve and at least one of the cylinder head and the intake manifold.

Positive crankcase ventilation ('PCV') valve mounting structure

The heater includes a heater main body, a housing storing the heater main body therein, and a coating material arranged in at least a part between the heater main body and the housing and covering at least a part of the heater main body. The coating material is a material containing at least one of ceramic and glass, the heater main body has a cylindrical honeycomb structural portion having partition walls separating and forming a plurality of cells and a pair of electrode portions disposed on a side face of the honeycomb structural portion, the housing contains the heater main body so as to cover the side face side of the heater main body, and the partition walls of the honeycomb structural portion is of a material containing ceramic as the main component and produces heat by energization.

Heater

There is disclosed a heater which does not excessively heat a lubricating fluid but can rapidly raise a temperature of the lubricating fluid, even when a size thereof is small. A heater includes a honeycomb structure section including partition walls which contain a ceramic as a main component and generate heat by electrical conduction, and a plurality of cells which are partitioned and formed by the partition walls and extend through the honeycomb structure section from one end to another end to become through channels of a lubricating fluid; and a pair of electrodes which become an anode and a cathode to come in contact with the honeycomb structure section, thereby conducting the electricity through the partition walls of the honeycomb structure section.

An electrostatic chuck is provided with a ceramic substratein which an electrodeis embedded, an electrode terminalexposed at the bottom of a concave portiondisposed on the back surface of the ceramic substrate, a power feed memberto supply an electric power to the electrode, and a joining layerto connect this power feed memberto the ceramic substrate. The joining layeris formed by using a AuGe based alloy, a AuSn based alloy, or a AuSi based alloy. The ceramic substrateand the power feed memberare selected in such a way that the thermal expansion coefficient difference D calculated by subtracting the thermal expansion coefficient of the ceramic substratefrom the thermal expansion coefficient of the power feed membersatisfies &#x2212;2.2&#x2266;D&#x2266;6 (unit: ppm/K).

Member for semiconductor manufacturing apparatus

A method for manufacturing an alumina sintered body of the present invention comprises: (a) forming a mixed powder containing at least AlOand MgFor a mixed powder containing AlO, MgF, and MgO into a compact having a predetermined shape; and (b) performing hot-press sintering of the compact in a vacuum atmosphere or a non-oxidizing atmosphere to form an alumina sintered body, in which when a amount of MgFto 100 parts by weight of AlOis represented by X (parts by weight), and a hot-press sintering temperature is represented by Y (&#xb0; C.), the hot-press sintering temperature is set to satisfy the following equations (1) to (4)1,120&#x2266;&#x2266;1,300&#x2003;&#x2003;(1)0.15&#x2266;&#x2266;1.89&#x2003;&#x2003;(2)&#x2266;&#x2212;78.7+1,349&#x2003;&#x2003;(3)&#x2267;&#x2212;200+1,212&#x2003;&#x2003;(4).

Alumina sintered body, method for manufacturing the same, and semiconductor manufacturing apparatus member

A gas-impermeable fuel cell separator including ribs that form a gas flow passage, and a sealing section, wherein at least the gas flow passage has a hydrophilically treated surface, and in which the fuel cell separator base material is exposed within the sealing section.

Fuel cell separator, method of manufacturing fuel cell separator, and fuel cell

A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.

Different materials bonded member and production method thereof

A porous composite material includes a metal material for forming a matrix, and at least two kinds of fine particle materials having different wettabilities with respect to the metal material. The porous composite material is provided by melting and impregnating the metal material for forming a matrix with the mixture of at least two kinds of fine particle materials. The porous composite material has excellent characteristics in shock absorbency, acoustics, non-combustibility, lightness, rigidity, and so forth.

Porous metal based composite material

A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.

Laminated radiation member, power semiconductor apparatus, and method for producing the same

A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.

Method for producing a circuit board

A bonded member including a ceramic base materialand a metallic memberwhich are bonded together, wherein a solder materialcomprising Au is disposed on the surface of the ceramic base materialvia an active metal layer, the active metal layer and the solder materialare molten by heating so as to form a precoat layer, the metallic memberis disposed on the surface of the precoat layervia an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layerare molten by heating to bond the metallic memberand the precoat layer

Bonded member comprising different materials, and production method thereof

A composite materialin which a dispersing materialis dispersed in a matrixis provided. The composite materialis producible by steps of

Composite material and method for production of the same

A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an SiNlayer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.

Growing community of inventors

Ama-gun, Japan

Masahiro Kida