Hitachi Chemical Company, Ltd.

Masahiro Katou

Eiichi Shinada

Hiroshi Wada

Yasuyuki Koshikawa

Noriaki Watanabe

A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.

Multilayer wiring board

Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board () is provided with a wiring, which has a wiring section and a bump mounting pad (), and a substrate section. The method is provided with a step of forming a solder bump () on at least a bump mounting pad on the first printed board or a pad section of a second printed board () having the pad section () by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive () between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

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Chikusei, Japan

Masahiro Katou