Mitsubishi Heavy Industries Limited

Mitsubishi Electric Corporation

Hitachi, Ltd.

Honda Motor Co., Ltd.

Nagoya University

Suzuki Motor Corporation

Chugai Seiyaku Kabushiki Kaisha

Calsonic Kansei Corporation

Denka Company Limited

Japan Aerospace Exploration Agency

Daiichi Pharmaceutical Co., Ltd.

Mitsubishi Heavy Industries Thermal Systems, Ltd.

Gunma University

Oriental Photo Industrial Co., Ltd.

Kabushiki Kaisha Toshiba

Masahiro Kato

Shinya Nunoue

Shinya Nakagawa

Shinji Sakai

Takayuki Abe

Yasushi Hattori

Yoshikatsu Kuroda

Hisashi Kawafuji

Toru Iwagami

Maki Hasegawa

Kazunori Masukawa

Naoki Inoue

Yoshiyuki Kondo

Koichi Hamamoto

Shingo Nishikata

Atsushi Kodama

Yuichi Otani

Hiroyuki Daigo

Akio Nagasaka

Koji Sato

Daisuke Kobayashi

Takeshi Kato

Yutaka Saito

Naoto Miura

Naotoshi Matsuda

Yumi Fukuda

Toshiyuki Furuta

Keiko Albessard

Iwao Mitsuishi

Ryosuke Hiramatsu

Tomoya Morioka

Masahiro Yoshida

Katsuhiro Fujita

Aoi Okada

Yusuke Matsuda

Hiroyoshi Watanabe

Hiroshi Ito

Daisuke Matsuura

Kiyoto Ito

Yasuhide Mori

Fumihito Soma

Masahito Yamaguchi

Yoshiteru Komuro

Yuto Tanabe

Eiichi Shinada

Keisuke Ando

Yoshio Miki

Kiyoshige Ochi

Naoki Ozawa

Tomohisa Moro

Noboru Kubodera

Shin Watanabe

Tadayuki Takahashi

Tetsuya Ohno

Yo Nonomura

Nobuhiro Sekimoto

Keiichiro Nakazaki

Kazuyuki Hirose

Tomofumi Tanaka

Masato Ohta

Yasuhiko Yokomori

Kazuo Arakawa

Shinya Shirakawa

Hideki Suetake

Hideo Suda

Shogo Kida

Hirofumi Shimada

Takashi Nakano

Osamu Kawasaki

Keijiro Koide

Tetsuhiro Mikami

Shinji Shimoyama

Ryohei Matsumoto

Kunio Kurata

Hideki Kajiwara

Takanori Narita

Minako Toba

Mitsutaka Yamaguchi

Naoki Kawachi

Asato Ikezumi

Yoshinobu Kubo

Yoshiharu Matsuoka

Tatsuki Tanaka

Yushi Kumagai

Hiroshi Kawato

Shinichiro Takeda

Hirokazu Odaka

Kei Genba

Jyunichi Kimura

Yo Watanabe

Koichi Tani

Yuya Kakehashi

Taichi Ito

Toshihiro Takahata

Masakazu Takei

Tadayoshi Miura

Shuhei Iriyama

Toshiyuki Yoshioka

Yuya Igarashi

A photographing apparatus includes an irradiation unit configured to irradiate a living body with beams of light having a plurality of wavelengths different from one another, a photographing unit configured to photograph the living body irradiated by the irradiation unit to generate image data of the living body, an image processing module configured to generate, based on the image data generated by the photographing unit, a plurality of pieces of wavelength separation image data, by separation into the plurality of wavelengths, and a control module configured to control, based on the image data and on the plurality of pieces of wavelength separation image data generated by the image processing module, irradiation light amounts of the beams of light having the plurality of wavelengths.

Photographing apparatus and authentication apparatus

An observation control device is applicable to a detector installed onboard a spacecraft for performing observation. The observation control device includes an orthogonal direction control unit configured to move an observation range in a direction orthogonal to a travel direction of the spacecraft, the observation range being a range observed by the detector, and a travel direction control unit configured to move the observation range in the travel direction of the spacecraft.

Observation control device and spacecraft, observation control method, and observation control program

The present invention relates to a reservoir tank for coolant that stores the coolant for cooling an internal combustion engine. The reservoir tank includes: a tank chamber that stores the coolant; an opening, which is disposed in an upper part of the tank chamber, through which the coolant flows in and flows out, and in a circumferential wall of which a breathing hole is formed; and a first communication passage, a second communication passage, and a third communication passage that respectively communicate with the opening and the tank chamber.

Reservoir tank for coolant

A two-pack curable composition set having: a first agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, a thermally conductive filler, a silica powder, and a platinum catalyst, and having a viscosity at 25° C. at a shear rate of 10 sof 20 to 150 Pa·s; and a second agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, and a polydimethylsiloxane having a hydrosilyl group at least at an end or in a side chain, a thermally conductive filler, and a silica powder, and having a viscosity at 25° C. at a shear rate of 10 sof 20 to 150 Pa·s.

Two-pack curable composition set, thermally conductive cured product, and electronic device

A method for manufacturing a multilayer wiring board is disclosed. The Method comprises a step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive material provided between the facing electrical connection pads. In the step (I), to at least one of surfaces faced when the boards are overlaid in the step (II), an insulating film having through holes formed in positions corresponding to the electrical connection pads on the surface is attached (Ia), and the conductive material is provided in the through holes (Ib).

Method for manufacturing multilayer wiring board

A method for manufacturing a multilayer wiring board is disclosed. The method includes steps of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane, overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. To prepare the printed wiring boards, attach an insulating film to at least one of surfaces faced when the boards are overlaid in the overlaying, bore holes in the insulating film so that the electrical connection pads are exposed, and provide a conductive paste in the holes.

A multichip module provided with a first substrate, a first semiconductor chip, a second substrate and a third substrate. The first semiconductor chip has a first surface provided with a first electrode and a second surface mounted on the first substrate so that the first wiring of a first mount surface of the first substrate is electrically connected to the first electrode. The second substrate has a second mounting surface and a third mounting surface bonded to the first substrate so that the second mounting surface is opposed to the first mounting surface. The third substrate has a fourth mounting surface provided with a second wiring and a fifth mounting surface bonded to the second silicon substrate so that the fourth mounting surface is opposed to the third mounting surface and is mounted with the first semiconductor chip so that the second wiring is electrically connected to the second surface.

Multichip module and electronic device

There is provided a vehicle body structure including: a seat member storable in a floor of a vehicle body; a front door disposed on a vehicle-width directional outer side relative to the seat member; a first load transmission member and a second load transmission member disposed in the front door and configured to transmit a side collision load to the seat member at a side collision. The first load transmission member and the second load transmission member are arranged higher than an upper surface of the seat member being in a dive-down stored condition.

Vehicle body structure

An operation adjustment method of an SOI device comprises steps of: (a) obtaining a drain current-substrate bias voltage characteristic of an NMOS transistor for a source-gate voltage of 0V; (b) obtaining a lowest substrate bias voltage which turns on the NMOS transistor from the drain current-substrate bias voltage characteristic; (c) determining an upper limit of a substrate bias voltage of a PMOS transistor as a voltage obtained by subtracting a built-in potential of a pn junction from the lowest substrate bias voltage; and (d) determining the substrate bias voltage of the PMOS transistor as a positive voltage lower than the upper limit. Reduction in the power consumption and maintenance of the radiation tolerance are both achieved for the SOI device.

Semiconductor device

An object of the present invention is to achieve favorable sealability by a simple and low-cost structure using an O-ring. A sealing structure according to the present invention is provided with: a first sealing surface formed in an annular shape on a first container structural member configuring a housing (container); a second sealing surface overlaid on the first sealing surface, formed in annular shape on a second container structural member configuring the housing; a plurality of concentric O-ring grooves formed on at least one of the first sealing surface and second sealing surface; and a plurality of O-rings fitted into the plurality of O-ring grooves. The filling ratio of the O-ring in the O-ring groove positioned on an outer side of the housing is larger than the filling ratio of the O-ring in the O-ring groove positioned on an inner side of the housing.

Sealing structure for airtight container and vehicle refrigerant compressor provided with said structure

A seat belt apparatus provided in a front door of a vehicle, comprises a retractor provided in the front door and configured to retract a webbing for constraining an occupant so as to be pulled out, a belt anchor provided in the front door and attached with one end of the webbing, and a latch configured to engage the front door to a vehicle body. The latch is provided between the retractor and the belt anchor in a longitudinal direction of the vehicle body.

Seat belt apparatus

A multichip module includes a plurality of semiconductor substrates and a plurality of surface mounting parts. The plurality of semiconductor substrates each have a wiring line region which contains a wiring line to pierce from one of the surfaces to the other surface. A plurality of surface mounting parts are mounted on either of the plurality of surface mounting parts. The plurality of semiconductor substrates are stacked to form a multilayer structure. The first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inside region of the multilayer structure.

Multichip module including surface mounting part embedded therein

In an aerospace vehicle in which a satellite is detachably adapted to the first stage rocket and the second stage rocket, an electronic deviceis installed in the satellite, wherein the electronic devicecontrols the first stage rocketand the second stage rocketbefore the satellite is detached from the first stage rocketand the second stage rocket. Thereby, it is unnecessary to provide sensors, radio devices and electronic devices for exclusive use with respect to the first stage rocketand the second stage rocketso that a manufacturing cost of the rocketsandcan be reduced and a total weight of the rocketsandcan become lighter by omitting these equipments. Thus, an aerospace vehicle system within the rocketsandcan be simplified and a launch of the aerospace vehicle can be prepared within a short period.

Aerospace vehicle system

A power module is a power module having a PFC (power factor correction) function. The power module includes: IGBTs in a pair; first diodes in a pair connected to the IGBTs in a pair, the first diodes forming a reverse-conducting element; and second diodes in a pair connected to the IGBTs in a pair, the second diodes having a rectifying function. The power module further includes a driving IC that drives the IGBTs in a pair, and P terminals in a pair provided independently of each other. The P terminals are connected to one ends of the first diodes in a pair, respectively, the one ends being opposite to the other ends of the first diodes to which the IGBTs in a pair are connected.

Power module and air conditioner

This solid laser amplification device has: a laser medium part that has a solid medium, into which a laser light enters from an entrance part and from which the laser light (L) is emitted to the outside from an exit part, and an amplification layer, which is provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects said light toward the exit part; a microchannel cooling part that cools the amplification layer; and a thermally conductive part that is provided so as to make contact between the amplification layer and the cooling part and transfers the heat of the amplification layer to the cooling part.

Solid laser amplification device

Growing community of inventors

Tokyo, Japan

Masahiro Kato