Shin-etsu Chemical Co., Ltd.

Masahiro Kaneta

Kazuaki Sumita

Shoichi Osada

Yoshihiro Tsutsumi

Naoyuki Kushihara

Norifumi Kawamura

Tadashi Tomita

Kenji Hagiwara

Ryuhei Yokota

Taro Shimoda

Hiroki Oishi

Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains:

Epoxy resin composition for semiconductor encapsulation and semiconductor device

The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

Method for producing power module, and power module

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Annaka, Japan

Masahiro Kaneta