Fujikura Limited

Texas Instruments Japan Limited

Other

Masahiro Kaizu

Masatoshi Inaba

Tadanori Ominato

Akihito Kurosaka

Takanao Suzuki

Mutsumi Masumoto

Kenji Masumoto

Nobuyuki Sadakata

Atsuhiro Horii

Koji Hirai

Kenichi Okada

Takayuki Imai

Masahiko Arai

Nobuo Tanabe

Yukihiko Kurosawa

Masateru Ichikawa

Sadamitsu Jumonji

Yoshihito Seki

A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes 'N' times, where 'N' denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N&#x2212;1)th operations includes forming a surface of the sintering layer in an uneven shape.

Method of manufacturing conductive layer and wiring board

The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragmcomprises a thin plate having flexibility and conductivity, and the key switch diaphragmincludes a truncated pedestal, and a spherical domical portionbeing raised toward an upper portion of the pedestalon the side of the upper portion of the pedestal. The domical portionis provided at its substantially central portion with an outwardly raised portionbeing raised toward an outer surface of the domical portion. An edge of the outwardly raised portionon the side of its inner surface forms a contact

Membrane for key switch and the key switch

An insulating layer () having an opening portion () at a position conformable to an electrode pad () is formed. Next, a resin projection portion () is formed on the insulating layer (). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (), the resin projection portion () and the region sandwiched therebetween. A Cu plating layer () is formed by electrolytic copper plating, using the resist film as a mask.

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Semiconductor package, semiconductor device and electronic device

An insulating layer ( ) having an opening portion ( ) at a position conformable to an electrode pad ( ) is formed. Next, a resin projection portion ( ) is formed on the insulating layer ( ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion ( ), the resin projection portion ( ) and the region sandwiched therebetween. A Cu plating layer ( ) is formed by electrolytic copper plating, using the resist film as a mask.

Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package

Diaphragm for a switch

A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.

Flexible printed circuit board

A multi-layer structured printed circuit substrate having an upper conductive layer and a lower conductive layer with an inter-layer insulating layer is used. A chip assembly part of bump connection type is formed by forming openings in a portion of the upper conductive layer and the inter-layer insulating layer in order to expose the lower conductive layer. A bear chip is buried in the chip assembly part for assembly. A sealing member is filled in the lower space of the bear chip. A flat plate type radiating plate having an opening corresponding to the chip assembly part is located on the substrate and a heat conductive adhesive is filled between the radiating plate and the bear chip.

Chip assembly module of bump connection type using a multi-layer printed circuit substrate

An insulating layer ( ) is formed on a Si wafer ( ). An opening portion is made in this insulating layer ( ), and subsequently a rerouting layer ( ) is formed. Next, a resin layer ( ) is formed on the rerouting layer ( ). The resin layer ( ) is then cured so that the rerouting layer ( ) and a Cu foil ( ) are bonded to each other through the resin layer ( ). Thereafter, a ring-like opening portion ( ) is made in the resin layer ( ), and a Cu plating layer ( ) is formed inside this opening portion ( ).

Semiconductor package, semiconductor device, electronic device and production method for semiconductor package

A light illumination membrane switch having a configuration with a reduced size, capable of realizing an effective light illumination of the keys and a highly reliable operation even under the high humidity environment. The switch has a light source section using an LED bare chip element for emitting lights to illuminate the key section which is directly mounted on the electrode circuit member of the printed circuit board. The switch may includes a translucent diffuser member having a cavity region for directly transmitting the lights emitted from the light source section to the key section. The switch may includes a translucent diffuser member having a side wall portion defining an opening such that the translucent diffuser member and the printed circuit board are assembled together by inserting the printed circuit board into the opening defined by the side wall portion. The switch may includes a translucent diffuser member having reflective coating layer formed thereon for reflecting the lights emitted from the light source section into the translucent diffuser member.

Light illumination membrane switch with reduced size and improved light

A light illumination membrane switch having a configuration with a reduced size, capable of realizing an effective light illumination of the keys and a highly reliable operation even under the high humidity environment. The switch has a light source section using an LED bare chip element for emitting lights to illuminate the key section which is directly mounted on the electrode circuit member of the printed circuit board. The switch may include a translucent diffuser member having a cavity region for directly transmitting the lights emitted from the light source section to the key section. The switch may include a translucent diffuser member having a side wall portion defining an opening such that the translucent diffuser member and the printed circuit board are assembled together by inserting the printed circuit board into the opening defined by the side wall portion. The switch may include a translucent diffuser member having reflective coating layer formed thereon for reflecting the lights emitted from the light source section into the translucent diffuser member.

A click-action membrane switch unit comprises a flexible base film having two surfaces, flexible circuits formed on at least one of the two surfaces of the base film and having interdigitating electrode contacts, a resist film formed on the flexible circuits and having a window in the region of the electrode contacts, a dome-shaped click spring made of electrically conducting material and having an edge placed on the circuits, and a layer fixed to the other surface of the base film and having an opening formed in the portion of the layer which aligns with the click spring.

Growing community of inventors

Tokyo, Japan

Masahiro Kaizu