Toshiba Lighting & Technology Corporation

Nec Corporation

Masahiro Izumi

Tomohiro Sanpei

Akiko Saito

Yumiko Hayashida

Kiyoshi Otani

Kiyoshi Nishimura

Shinji Nogi

Yutaka Honda

Yuichiro Takahara

Nobuhiro Tamura

Shigeru Osawa

Nobuhiko Betsuda

Kazuto Morikawa

Akimichi Takahashi

Soichi Shibusawa

Shuhei Matsuda

Erika Takenaka

Toshiyuki Ikeda

Takeshi Osada

Keiichi Shimizu

Jun Sasaki

Tsuyoshi Oyaizu

Hiroshi Matsushita

Yusuke Shibahara

Seiko Kawashima

Tatsumi Ide

Takeo Yasuda

Masahiro Toda

Kenji Takanashi

Haruki Takei

Yoshiyuki Matsunaga

Kunihiko Ikada

Ryotaro Matsuda

Takashi Yorifuji

Hiromichi Nakajima

Junichi Kimiya

Hiroshi Takenaga

Akiko Saitou

Junya Murata

Noriyuki Hayama

Mitsuru Shiozaki

Tetsuya Oono

Toshifumi Sakurai

Kimio Sugimura

Mitsunori Nakamura

According to one embodiment, a lamp apparatus includes a light-emitting module, housing, and a lighting circuit. The light-emitting module includes a light-emitting element. The housing opens in the direction of irradiation of a light beam and having a cap on a side opposite from the direction of irradiation of the light beam. The cap is provided with a light-emitting module mounting portion projecting in the direction of irradiation of the light beam and the light-emitting module is mounted on the light-emitting module mounting portion. The lighting circuit is accommodated in the housing.

Luminaire and lamp apparatus housing

A light emitting module () comprises a module substrate (), a light emitting diode string (), and a sealing member (). The light emitting diode string () includes light emitting diode elements () and bonding wires () which connect the light emitting diode elements (). The light emitting diode element () has a pair of element electrodes () and has a rectangular shape extending in a direction along which the element electrodes () are aligned. The sealing member () is laminated on the module substrate () to seal the light emitting diode string (). The light emitting diode elements () are arranged at intervals in a direction crossing the direction along which the element electrodes () are aligned, and the element electrodes () with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements () between the light emitting diode elements () adjacent to each other. Each bonding wire () is obliquely wired with respect to the arrangement direction of the light emitting diode elements () to connect the element electrodes () with different polarities of the light emitting diode elements () adjacent to each other.

Light emitting module and illumination apparatus

According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

Light emitting device and illumination device

An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

Illumination apparatus having a plurality of semiconductor light-emitting devices

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Illumination device with semiconductor light-emitting elements

According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Light emitting device and lighting apparatus

Light emitting diode module

According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Light emitting module and illumination device

An auxiliary amalgam is contained in a light-emitting tube. The auxiliary amalgam has a base, a metal layer provided on the base, and a diffusion-inhibiting layer provided between the base and the metal layer.

Fluorescent lamp, bulb-shaped fluorescent lamp, and lighting apparatus

A bulb-shaped fluorescent lamp with an emission bulb having a bent tube and a lighting device having a circuit board and electronic parts mounted on the circuit board. The lighting device has a cover member with a cap and a holder for holding the emission bulb and the circuit board has a great part of its electronic parts disposed on the cap side. The lighting device has a fine tube that extends from the end of a portion of the bent tube toward the cap side within the cover member, and protrudes so that the surface temperature of a portion of said fine tube is kept in the range between 40&#x2013;70&#xb0;C. at the time of normal lighting and/or the fine tube extending from the end of the bent tube toward the cap side within the cover member protrudes from the end of said bent tube by 25&#x2013;70 mm.

Bulb-shaped fluorescent lamp and illumination device

Growing community of inventors

Fujisawa, Japan

Masahiro Izumi